Metallic complexes covalently bound to conjugated polymers and electronic devices containing such compositions
申请人:——
公开号:US20040072018A1
公开(公告)日:2004-04-15
The present invention relates to polymeric metal complexes comprising metallic complexes covalently bound to conjugated polymers and luminescent materials containing such polymeric metal complexes. The invention further relates to electronic devices in which the active layer includes such polymeric metal complexes.
本发明涉及聚合物金属配合物,其包括共价结合到共轭聚合物和含有这种聚合物金属配合物的发光材料的金属配合物。本发明还涉及包括这种聚合物金属配合物的活性层的电子器件。