1-(2-Ethenylphenyl)-1H-pyrrole-2,5-dione | 88520-98-3

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯啉
• 英文名称: 1-(2-Ethenylphenyl)-1H-pyrrole-2,5-dione
• 英文别名: 1-(2-ethenylphenyl)pyrrole-2,5-dione
• CAS: 88520-98-3
• 化学式: C₁₂H₉NO₂
• 分子量: 199.2
• InChiKey: XNQKUIMPTJUDAH-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.8
• 重原子数：
  15
• 可旋转键数：
  2
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  37.4
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• Curable resin composition
  申请人：MITSUI TOATSU CHEMICALS, Inc.

  公开号：EP0077840A1

  公开（公告）日：1983-05-04

  Disclosed is a curable resin composition comprising a) at least one maleimide compound selected from the group consisting of N-(alkenylphenyllmaleimide derivatives, and dimers and polymers thereof and b) one or more kinds of epoxy resins, each having at least one epoxy group in the unit molecule thereof. The resin composition may contain, besides the above two components, an amino compound as a further component c). The resin composition may comprise a prepolymer of any two components among the three components a), b) and c) and the remaining component.

  本发明公开了一种可固化树脂组合物，该树脂组合物包含 a) 至少一种马来酰亚胺化合物，该化合物选自由 N-(烯基苯基)马来酰亚胺衍生物及其二聚体和聚合物组成的组，以及 b) 一种或多种环氧树脂，每种环氧树脂的单位分子中至少有一个环氧基团。除上述两种成分外，树脂组合物还可含有一种氨基化合物作为 c) 成分。树脂组合物可包括 a)、b)和 c)三种组分中任意两种组分的预聚物和其余组分。
• Heat-resistant resin composition
  申请人：SHOWA DENKO KABUSHIKI KAISHA

  公开号：EP0348906A1

  公开（公告）日：1990-01-03

  A resin composition comprising (A) at least one heat-resistant resin, (B) at least one thermoplastic resin, (C) an antimony oxide, (D) at least one bromine-­containing reaction product selected from the group consisting of (1) a compound having a molecular weight of from 1,200 to 6,000 and a bromine content of from 5.0 to 60% by weight which is obtained by reacting a bromine-containing epoxy compound and 1,3,5-­tribromophenol, and (2) a compound obtained by reacting a bromine-containing epoxy compound having an epoxy equivalent of from 450 to 7,000 and a bromine content of from 5.0 to 52% by weight and an acrylonitrile-butadiene copolymer having a carboxyl group at the both terminals thereof and a molecular weight of from 1,000 to 10,000, and (E) at least one silicon-containing compound selected from the group consisting of (1) silicone oil, (2) a ladder silicone resin, and (3) an alkoxysilane having a mercapto group, a vinyl group or a methacryloyl group, is disclosed. The resin composition is excellent in heat resistance, impact resistance, flame retardancy, and molding properties.

  一种树脂组合物，包括(A) 至少一种耐热树脂，(B) 至少一种热塑性树脂，(C) 氧化锑，(D) 至少一种含溴反应产物，该反应产物选自以下组别：(1) 一种化合物，其分子量为 1,200 至 6,000 之间，溴含量为 5.0至60%(重量)的化合物，它是由含溴环氧化合物和1,3,5-三溴苯酚反应得到的；和(2)由含溴环氧化合物和含溴环氧化合物反应得到的化合物，含溴环氧化合物的环氧当量为450至7,000，溴含量为5.(E) 至少一种含硅化合物，选自(1)硅油，(2)阶梯硅树脂和(3)具有巯基、乙烯基或甲基丙烯酰基的烷氧基硅烷组成的组。该树脂组合物具有优异的耐热性、抗冲击性、阻燃性和成型性能。
• Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
  申请人：HITACHI CHEMICAL CO., LTD.

  公开号：EP1517595A2

  公开（公告）日：2005-03-23

  There are provided a resin composition comprising a crosslinking component with a weight average molecular weight of 1,000 or less having a, plurality of styrene groups and represented by the following formula: wherein R is a hydrocarbon skeleton, each of R1s is a hydrogen atom or a hydrocarbon group, each of R2, R3 and R4 is a hydrogen atom or an alkyl group, m is an integer of 1 to 4, and n is an integer of 2 or more, at least one high-molecular weight compound, an inorganic filler, and at least one treating agent for said inorganic filler; its cured product; and a prepreg, a laminate sheet having a conductor layer, and a multilayer printed wiring board obtained by processing the conductor layer of the laminate sheet into wiring.

  提供了一种树脂组合物，该树脂组合物包含一种交联组分，其重量平均分子量为 1,000 或以下，具有多个苯乙烯基团，并由下式表示： 其中 R 是烃骨架，R1s 各为氢原子或烃基，R2、R3 和 R4 各为氢原子或烷基，m 为 1 至 4 的整数，n 为 2 或 2 以上的整数，至少一种高分子量化合物，一种无机填料，以及至少一种用于所述无机填料的处理剂；其固化产品；以及预浸料、具有导体层的层压板和通过将层压板的导体层加工成线路而获得的多层印刷线路板。
• Resin composition and pre-preg and laminate using the composition
  申请人：Shengyi Technology Co., Ltd.

  公开号：US10584222B2

  公开（公告）日：2020-03-10

  Provided in the present invention are a resin composition and a pre-preg and a laminate using the composition. The resin composition comprises: (A) a prepolymer of a polyolefin resin and a bifunctional maleimide or a multifunctional maleimide; and, (B) vinyl thermosetting polyphenylene ether, where with the weight of the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide being 100 parts by weight, the weight of the vinyl thermosetting polyphenylene ether is 200 to 1000 parts by weight. The present invention, by employing the prepolymer of the polyolefin resin and the bifunctional maleimide or the multifunctional maleimide, solves the problem of incompatibility of the bifunctional maleimide or the multifunctional maleimide with the polyolefin resin and vinyl thermosetting polyphenylene ether. An aqueous glue solution so mixed is uniform and consistent, the pre-preg has a uniform expression, and a substrate resin area is free of a phase-separation problem.

  本发明提供了一种树脂组合物以及使用该组合物的预浸料和层压板。该树脂组合物包括：(A) 聚烯烃树脂和双官能团马来酰亚胺或多功能马来酰亚胺的预聚物；(B) 乙烯基热固性聚苯醚，其中聚烯烃树脂和双官能团马来酰亚胺或多功能马来酰亚胺的预聚物的重量为 100 重量份，乙烯基热固性聚苯醚的重量为 200 至 1000 重量份。本发明采用聚烯烃树脂和双官能马来酰亚胺或多官能马来酰亚胺的预聚物，解决了双官能马来酰亚胺或多官能马来酰亚胺与聚烯烃树脂和乙烯基热固性聚苯醚不相容的问题。这样混合的胶水水溶液均匀一致，预浸料具有均匀的表现形式，基底树脂区域也不会出现相分离问题。
• Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof
  申请人：——

  公开号：US20020161091A1

  公开（公告）日：2002-10-31

  According to the present invention, there is provided a low dielectric loss tangent resin composition containing a crosslinking component having a weight average molecular weight of not more than 1,000 and a plurality of styrene groups and represented by the formula [1], 1 wherein R is a hydrocarbon skeleton which may have a substituent, R 1 is hydrogen, methyl or ethyl, m is an integer of 1-4 and n is an integer of 2 or more, and further containing at least one member selected from a high polymer having a weight average molecular weight of not less than 5,000 and a filler, which resin composition can give a cured product having a good flexibility, high tensile strength and low dielectric constant and dielectric loss tangent.

  根据本发明，提供了一种低介电损耗正切树脂组合物，该组合物含有重量平均分子量不超过 1 000 的交联组分和多个苯乙烯基团，并由式[1]表示、 1 其中 R 是烃骨架，可带有取代基，R 1 是氢、甲基或乙基，m 是 1-4 的整数，n 是 2 或 2 以上的整数，还含有至少一种选自重量平均分子量不小于 5,000 的高聚物和一种填料，这种树脂组合物可制成具有良好柔韧性、高拉伸强度、低介电常数和介电损耗正切的固化产品。