2,2'-[Methylenebis(oxymethylene)]bis(oxirane) | 29194-36-3

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 环氧化物
• 英文名称: 2,2'-[Methylenebis(oxymethylene)]bis(oxirane)
• 英文别名: 2-(oxiran-2-ylmethoxymethoxymethyl)oxirane
• CAS: 29194-36-3
• 化学式: C₇H₁₂O₄
• 分子量: 160.17
• InChiKey: DFZBVAIXDVWAOM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -0.6
• 重原子数：
  11
• 可旋转键数：
  6
• 环数：
  2.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• Metal Thietane Compound, Polymerizable Composition Containing the Compound, Resin and Use of the Resin
  申请人：Murakami Masakazu

  公开号：US20130018169A1

  公开（公告）日：2013-01-17

  Polymerizable compositions containing at least one metal thietane compound represented by general formulas (110), (201) or (120), respectively, wherein said formulas are as follows: and wherein the identified moieties and n, p, q and r are defined.

  含有至少一种由通式（110）、（201）或（120）表示的金属噻吩化合物的聚合物组合物，其中所述的通式如下：其中所识别的基团和n、p、q和r已被定义。
• Reworkable thermosetting resin composition
  申请人：Klemarczyk Philip T.

  公开号：US20080214840A1

  公开（公告）日：2008-09-04

  This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

  这项发明涉及热固性树脂组合物，适用于安装在电路板上的半导体器件，如CSPs、BGAs、LGAs等，每个器件都有一个半导体芯片，如LSI，安装在载体基板上。本发明的组合物在适当条件下可重复加工。
• METAL THIETANE COMPOUND, POLYMERIZABLE COMPOSITION CONTAINING THE COMPOUND, RESIN AND USE OF THE RESIN
  申请人：Murakami Masakazu

  公开号：US20100240862A1

  公开（公告）日：2010-09-23

  Disclosed is a metal thietane compound represented by the following general formula (120), (wherein, in the above general formula (120), M is a member selected from the group consisting of Bi, Sb, Ti, Zr and Ta; X 1 and X 2 are each independently a sulfur atom or an oxygen atom; R 1 is a divalent organic group; the bond between M and T shown by a dotted line and a solid line represents a single or double bond; m is an integer of 0 or 1 or more; n is the number of valence of M; and p is an integer of equal to or more than 1 and equal to or less than n, provided that when r is 1, q is 0 and Y is a monovalent inorganic or organic group; when r is 1 and n-p-q is 2 or more, a plurality of Ys contained are each independently selected from monovalent inorganic or organic groups; when r is 1 and n-p-q is 2 or more, a plurality of Ys may be bonded to each other to form a ring containing M; when r is 2, n-p-q is 1 or 2 and Y is a divalent group; when r is 2 and n-p-q is 2, two Ys may form a ring together with two Ms; and when r is 2 and q is 2, a plurality of Ts contained are each independently selected from inorganic or organic groups).

  公开了一种金属硫代环烷化合物，其通式如下（120），其中，在上述通式（120）中，M是从Bi、Sb、Ti、Zr和Ta组成的群体中选择的成员；X1和X2分别是硫原子或氧原子；R1是二价有机基团；M和T之间的键由虚线和实线表示，表示单键或双键；m是0或1或更多的整数；n是M的化合价数；p是大于或等于1且小于或等于n的整数，其中当r为1时，q为0且Y为一价无机或有机基团；当r为1且n-p-q为2或更多时，所含的多个Y各自独立地选择自一价无机或有机基团；当r为1且n-p-q为2或更多时，多个Y可以相互连接形成含M的环；当r为2时，n-p-q为1或2且Y为二价基团；当r为2且n-p-q为2时，两个Y可以与两个M一起形成环；当r为2且q为2时，所含的多个T各自独立地选择自无机或有机基团。
• METAL COMPOUND, POLYMERIZABLE COMPOSITION CONTAINING THE SAME, RESIN, METHOD FOR PRODUCING THE RESIN, AND USE OF THE RESIN
  申请人：Murakami Masakazu

  公开号：US20110136977A1

  公开（公告）日：2011-06-09

  Disclosed is a metal compound represented by the following formula (0): in the formula (0), A represents a thietane ring, or a monovalent group containing a thiol group; B represents a divalent group containing a heteroatom; R 2 represents a divalent organic group; n represents the valence of M; p represents an integer of 1 ton; M represents a lanthanoid atom or a barium (Ba) atom when A is a thietane ring, and represents a lanthanoid atom when A is a monovalent group containing a thiol group; or more than Y represents a monovalent inorganic or organic group; when n−p is not less than 2, a plurality of Y's each independently represent a monovalent inorganic or organic group; and when n−p is not less than 2, the plurality of Y's may be bonded with each other to form a ring containing M.

  揭示了一种由以下公式（0）表示的金属化合物： 在公式（0）中，A表示噻吩环或含有硫醇基的一价基团；B表示含有杂原子的二价基团；R2表示二价有机基团；n表示M的价；p表示1到n的整数；当A是噻吩环时，M表示镧系元素或钡（Ba）原子，当A是含有硫醇基的一价基团时，M表示镧系元素；Y表示一价无机或有机基团，当n-p不小于2时，多个Y可以各自独立地表示一价无机或有机基团；当n-p不小于2时，多个Y可以彼此连接形成含有M的环。
• ADDITIVE FOR POLYMERIZABLE COMPOSITION, POLYMERIZABLE COMPOSITION CONTAINING THE SAME AND USE OF THE POLYMERIZABLE COMPOSITION
  申请人：Ando Tomoyuki

  公开号：US20100286334A1

  公开（公告）日：2010-11-11

  The additive for a polymerizable composition according to the present invention contains a compound represented by the general formula (a). In the general formula (a), R represents a saturated hydrocarbon group having 1 to 3 carbon atoms. M represents Sn, Sb, Bi, or Ge. m represents 0 or 1. R and M are not directly bonded when m is 0. n represents an integer of 1 to 3. X represents a monovalent linking group, and a plurality of X may be the same as or different from each other. When two or more linking groups X are bonded with the metal atom M, the linking groups X may combine together to form a ring.

  本发明的聚合物组成物的添加剂包含由一般式（a）表示的化合物。在一般式（a）中，R表示具有1至3个碳原子的饱和碳氢基团。M表示Sn、Sb、Bi或Ge。m表示0或1。当m为0时，R和M不直接结合。n表示1至3的整数。X表示单价连接基团，多个X可以相同或不同。当两个或更多连接基团X与金属原子M结合时，连接基团X可以组合在一起形成环。