The present invention provides a solvent-free varnish composition, including: a thermosetting resin (A) having two or more (meth)acryloyl groups in a molecule thereof; a thermosetting resin (B) having one or more epoxy groups in a molecule thereof; a monofunctional vinyl-based monomer having an ether bond or an ester bond; an organic peroxide having a 10-hour half-life temperature of 40° C. or more; and a curing catalyst for an epoxy resin, in which a mixed resin of the thermosetting resin (A) and the thermosetting resin (B) has an epoxy equivalent of from 500 to 5,000. The solvent-free varnish composition can be used as an insulating varnish that shows a small energy loss and requires a short curing time in its curing treatment step, and that provides a cured product that barely causes the precipitation of an oligomer or the like even when exposed to a refrigerant-based environment containing a refrigerant and a refrigerating machine oil under high temperature and high pressure.
本发明提供了一种无溶剂清漆组合物,包括:分子中含有两个或两个以上(甲基)
丙烯酰基的热固性
树脂(A);分子中含有一个或一个以上环氧基的热固性
树脂(B);具有醚键或酯键的单官能
乙烯基单体;10 小时半衰期温度为 40°C 或更高的有机过氧化物;以及环氧
树脂的固化催化剂。其中热固性
树脂 (A) 和热固性
树脂 (B) 的混合
树脂的环氧当量为 500 至 5000。该无溶剂清漆组合物可用作绝缘清漆,在其固化处理步骤中能量损失小,固化时间短,即使暴露在高温高压下含有制冷剂和冷冻机油的制冷剂环境中,也能提供几乎不会导致低聚物等析出的固化产品。