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(β-phenethyl)-tri-(ethyl)-ammonium chloride

中文名称
——
中文别名
——
英文名称
(β-phenethyl)-tri-(ethyl)-ammonium chloride
英文别名
N,N,N-triethylbenzeneethanaminium chloride;triethyl(2-phenylethyl)azanium;chloride
(β-phenethyl)-tri-(ethyl)-ammonium chloride化学式
CAS
——
化学式
C14H24N*Cl
mdl
——
分子量
241.804
InChiKey
ARAAJMVUIASFJM-UHFFFAOYSA-M
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    0.11
  • 重原子数:
    16
  • 可旋转键数:
    6
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.57
  • 拓扑面积:
    0
  • 氢给体数:
    0
  • 氢受体数:
    1

反应信息

点击查看最新优质反应信息

文献信息

  • 5-H-1,3,4-thiadiazolo[3,2-a]pyrimidin-5-one compounds
    申请人:Janssen Pharmaceutica N.V.
    公开号:US04548938A1
    公开(公告)日:1985-10-22
    Novel 5H-thiazolo- and 5H-1,3,4-thiadiazolo[3,2-a]pyrimidin-5-one and 3,4-dihydro-2H,6H-pyrimido[2,1-b] [1,3]-thiazin-6-one derivatives, which compounds are useful psychotropic agents.
    小说 5H-噻唑并[3,2-a]嘧啶-5-酮和5H-1,3,4-噻二唑并[3,2-a]嘧啶-5-酮以及3,4-二氢-2H,6H-嘧啶并[2,1-b][1,3]-噻嗪-6-酮衍生物,这些化合物是有用的精神药物。
  • Novel bicyclic pyrimidin-5-one derivatives
    申请人:JANSSEN PHARMACEUTICA N.V.
    公开号:EP0070053A2
    公开(公告)日:1983-01-19
    Novel 5H-thiazolo- and 5H-1,3,4-thiadiazolo[3,2-a]-pyrimidin-5-one and 3,4-dihydro-2H,6H-pyrimido[2,1-b] [1,3]-thiazin-6-one derivatives, which compounds are useful psychotropic agents; a method of treating psychotropic diseases by the use of said compounds; pharmaceutical compositions containing same as an active ingredient and a method of preparing said pharmaceutical compositions.
    新型5H-噻唑并5H-1,3,4-噻二唑并[3,2-a]-嘧啶-5-酮和3,4-二氢-2H,6H-嘧啶并[2,1-b][1,3]-噻嗪-6-酮衍生物,这些化合物是有用的精神药物;使用上述化合物治疗精神疾病的方法;含有上述化合物作为活性成分的药物组合物和制备上述药物组合物的方法。
  • Solvent-free varnish composition, insulated coil, process for producing same, rotating machine, and closed electric compressor
    申请人:MITSUBISHI ELECTRIC CORPORATION
    公开号:US11155730B2
    公开(公告)日:2021-10-26
    The present invention provides a solvent-free varnish composition, including: a thermosetting resin (A) having two or more (meth)acryloyl groups in a molecule thereof; a thermosetting resin (B) having one or more epoxy groups in a molecule thereof; a monofunctional vinyl-based monomer having an ether bond or an ester bond; an organic peroxide having a 10-hour half-life temperature of 40° C. or more; and a curing catalyst for an epoxy resin, in which a mixed resin of the thermosetting resin (A) and the thermosetting resin (B) has an epoxy equivalent of from 500 to 5,000. The solvent-free varnish composition can be used as an insulating varnish that shows a small energy loss and requires a short curing time in its curing treatment step, and that provides a cured product that barely causes the precipitation of an oligomer or the like even when exposed to a refrigerant-based environment containing a refrigerant and a refrigerating machine oil under high temperature and high pressure.
    本发明提供了一种无溶剂清漆组合物,包括:分子中含有两个或两个以上(甲基)丙烯酰基的热固性树脂(A);分子中含有一个或一个以上环氧基的热固性树脂(B);具有醚键或酯键的单官能乙烯基单体;10 小时半衰期温度为 40°C 或更高的有机过氧化物;以及环氧树脂的固化催化剂。其中热固性树脂 (A) 和热固性树脂 (B) 的混合树脂的环氧当量为 500 至 5000。该无溶剂清漆组合物可用作绝缘清漆,在其固化处理步骤中能量损失小,固化时间短,即使暴露在高温高压下含有制冷剂和冷冻机油的制冷剂环境中,也能提供几乎不会导致低聚物等析出的固化产品。
  • Flame retarding resin composition
    申请人:——
    公开号:US20040077821A1
    公开(公告)日:2004-04-22
    Disclosed is a flame retarding resin composition comprising (A) one or more epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of the component B is a phosphorus-containing compound represented by the following formula (I): 1 wherein each symbol is as defined below. The flame retarding resin composition of the present invention without adding halogen or other flame retardants has high flame retardancy and excellent heat resistance. The flame retarding resin composition of the present invention is suitably useful in the application of thermosetting resins, thermoplastic resins, bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor molding materials and the like.
    本发明公开了一种阻燃树脂组合物,该组合物包含(A)一种或多种环氧树脂;(B)一种固化剂;以及(C)一种硬化促进剂,其中成分 B 的固化剂是由下式(I)表示的含磷化合物: 1 其中各符号定义如下。本发明的阻燃树脂组合物不添加卤素或其他阻燃剂,具有高阻燃性和优异的耐热性。本发明的阻燃树脂组合物适用于热固性树脂、热塑性树脂、粘合片、复合材料、层压板、印刷电路板、铜箔粘合剂、用于堆积工艺的油墨、半导体成型材料等。
  • Halogen-free resin composition
    申请人:——
    公开号:US20040147640A1
    公开(公告)日:2004-07-29
    Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): 1 wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.
    所公开的无卤素树脂组合物包括:(A) 一种或多种含磷环氧树脂;(B) 一种固化剂;(C) 一种硬化促进剂;(D) 一种聚苯醚树脂;以及 (E) 一种填充材料,其中成分 B 的固化剂具有下式 (I) 所表示的结构: 1 其中各符号如上定义。本发明的无卤素树脂组合物不添加卤素,具有优异的耐热性和阻燃性,以及优异 的介电性能。本发明的无卤素树脂组合物尤其适用于粘合片、复合材料、层压板、印刷电路板、铜箔粘合剂、用于堆积工艺的油墨、半导体包装材料等。
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