POLYCARBONATE RESIN, COATING LIQUID CONTAINING SAME, AND ELECTROPHOTOGRAPHIC PHOTOSENSITIVE BODY
申请人:Idemitsu Kosan Co., Ltd.
公开号:EP2378363A1
公开(公告)日:2011-10-19
Provided are: a urethane-based polycarbonate resin, including a repeating unit represented by the general formula [1], and a repeating unit represented by the general formula [2], in which the urethane-based polycarbonate resin has high wear resistance by virtue of a strong hydrogen bond between urethane groups; and an electrophotographic photoconductor, including a photosensitive layer provided on a conductive substrate, in which the electrophotographic photoconductor includes the above-mentioned polycarbonate resin as a component of the photosensitive layer, has high wear resistance, and maintains an excellent electrophotographic characteristic over a long time period: [Chem. 1] (Ar2 represents a group having a divalent aromatic group, and Ar1 represents a divalent aromatic group-containing group having a specific structure).
POLYCARBONATE COPOLYMER, AND COATING LIQUID AND ELECTROPHOTOGRAPHIC PHOTOSENSITIVE BODY USING SAME
申请人:Idemitsu Kosan Co., Ltd
公开号:EP2799461A1
公开(公告)日:2014-11-05
Provided are a polycarbonate copolymer, comprising: a repeating unit A represented by the following general formula (1); a repeating unit B represented by the following general formula (2); and a repeating unit C represented by the following general formula (3), in which: the polycarbonate copolymer has a presence ratiorepresentedbyAr1/(Ar1+Ar2+Ar3) of from 50 to 65 mol%, apresence ratio represented by Ar2/(Ar1+Ar2+Ar3) of from 25 to 45 mol%, and a presence ratio represented by Ar3/(Ar1+Ar2+Ar3) of from 3 to 25 mol%; and the repeating units B are not directly bonded to each other, and a coating liquid and an electrophotographic photosensitive body each obtained by using the copolymer, and as a result, provided are a polycarbonate copolymer remarkably improved in abrasion resistance while maintaining its stable solubility in an organic solvent, and a coating liquid and an electrophotographic photosensitive body each obtained by using the copolymer:
in the formulae, Ar1, Ar2, and Ar3 each independently represent a divalent aromatic group, and X1 and X2 each independently represent a single bond or -NH-, provided that Ar1 and Ar2 are not identical to each other.
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE, PRODUCTION METHOD FOR CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE
申请人:Asahi Kasei Kabushiki Kaisha
公开号:EP4006073A1
公开(公告)日:2022-06-01
To provide a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern.
Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.
Polyimides, coating composition formed therefrom and use thereof
申请人:Eternal Materials Co., Ltd.
公开号:US10280334B2
公开(公告)日:2019-05-07
A polyimide (PI) having two —COOH capping groups at each end is provided. A coating composition is further provided, which contains the PI and a hardening agent having 2 to 6 functional groups capable of reacting with —COOH. A PI coating layer and PI film formed by the coating composition of the present invention possess excellent chemical resistance and coefficient of thermal expansion (CTE), which makes them applicable in fabrication of protective materials for active/passive devices, optical materials, touch panels, copper foil substrates, soft flexible electronic materials or integrated circuit elements, or film substrate for glass film touch panels.
提供了一种聚酰亚胺(PI),其两端各有两个-COOH封端基团。本发明还提供了一种涂层组合物,其中包含 PI 和一种具有 2 至 6 个能与 -COOH 反应的官能团的硬化剂。由本发明的涂层组合物形成的 PI 涂层和 PI 薄膜具有优异的耐化学性和热膨胀系数(CTE),因此适用于制造有源/无源器件的保护材料、光学材料、触摸面板、铜箔基板、软挠性电子材料或集成电路元件,或玻璃薄膜触摸面板的薄膜基板。
Polyimide resin and metal-clad laminate comprising the same
申请人:ETERNAL MATERIALS CO., LTD.
公开号:US10995179B2
公开(公告)日:2021-05-04
The present disclosure provides a polyimide resin having at least two glass transition temperatures measured by dynamic mechanical analysis (DMA). Also, a metal-clad laminate including the polyimide resin.