过氧均苯四甲酸四叔丁酯 | 63472-69-5

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 中文名称: 过氧均苯四甲酸四叔丁酯
• 英文名称: Tetra-t-butylperoxypyromellitate
• 英文别名: tetratert-butyl benzene-1,2,4,5-tetracarboperoxoate
• CAS: 63472-69-5
• 化学式: C₂₆H₃₈O₁₂
• 分子量: 542.6
• InChiKey: KOAKWBXPXOTXGD-UHFFFAOYSA-N

物化性质

• 熔点：
  114 °C
• 沸点：
  664.0±55.0 °C(Predicted)
• 密度：
  1.167±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  5.5
• 重原子数：
  38
• 可旋转键数：
  16
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.62
• 拓扑面积：
  142
• 氢给体数：
  0
• 氢受体数：
  12

文献信息

• Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide
  申请人：——

  公开号：US20010056174A1

  公开（公告）日：2001-12-27

  An object of the present invention is to provide an epoxy modified polyimide, which is a resin capable of treating at a low processing temperature and having an excellent heat resistance; photosensitive composition; coverlay film, which is excellent in electrical insulation property, heat resistance for soldering, film-formability, flexibility, and chemical resistance; solder resist; and printed wiring board. The epoxy modified polyimide is obtained by synthesizing polyimide having a hydroxy group or carboxy group and subsequently reacting the polyimide with an epoxy compound. The photosensitive composition is obtained by adding a photoreaction initiator or the like to the epoxy modified polyimide. The coverlay film and the solder resist can be formed from the photosensitive composition. The printed wiring board is produced using the coverlay film and the solder resist.

  本发明的目的是提供一种环氧改性聚酰亚胺，它是一种能在低加工温度下处理的树脂，具有优异的耐热性；感光组合物；覆盖膜，它具有优异的电绝缘性能、焊接耐热性、成膜性、柔韧性和耐化学性；阻焊剂；以及印刷线路板。环氧改性聚酰亚胺是通过合成具有羟基或羧基的聚酰亚胺，然后使聚酰亚胺与环氧化合物反应而得到的。光敏组合物是通过向环氧改性聚酰亚胺中添加光反应引发剂或类似物而获得的。覆盖膜和阻焊可以由光敏组合物形成。使用覆盖膜和阻焊层生产出印刷线路板。
• Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board
  申请人：——

  公开号：US20040048978A1

  公开（公告）日：2004-03-11

  The present invention relates to a photosensitive resin composition having excellent heat resistance, processability, and adhesion, and a solder resist comprising the composition, a cover lay film, and a printed circuit board obtained from or with these. The cover lay film is excellent in processability and adhesion at relatively low temperatures and has a low elastic coefficient after curing while keeping sufficient mechanical strength, so that the cover lay film is preferably used for a printed circuit board or a hard disk. The cover lay film is soluble and can be laminated at temperatures of not higher than 150° C., and a solder resist having excellent properties, such as heat resistance which can be laminated directly onto FPC without any adhesives and a cover lay film having few warps when laminated onto the FPC can be provided according to the present invention. The photosensitive resin composition comprises as essential components: a soluble polyimide (A) dissolved in solvent having a boiling point of not higher than 120° C.; and a compound (B) having at least one aromatic ring and at least 2 double bonds in one molecule, wherein the soluble polyimide is one obtained at least from an acid dianhydride having 1 to 6 aromatic rings or alicyclic acid dianhydride and/or a diamine having 1 to 6 aromatic rings. The solder resist, cover lay film, etc. are excellent in heat resistance and mechanical properties and do not damage the substrate because they can be laminated at relatively low temperatures.

  本发明涉及一种具有优异的耐热性、加工性和附着力的光敏树脂组合物，以及一种由该组合物、覆盖层薄膜和印刷电路板组成的阻焊材料。覆盖膜在相对较低的温度下具有优异的加工性和附着力，固化后弹性系数低，同时保持足够的机械强度，因此覆盖膜最好用于印刷电路板或硬盘。根据本发明，盖层薄膜是可溶的，可以在不高于 150°C 的温度下层压，并且可以提供一种具有优异性能（如耐热性）的阻焊剂，这种阻焊剂可以不使用任何粘合剂直接层压到 FPC 上，并且层压到 FPC 上时盖层薄膜很少翘曲。光敏树脂组合物的主要成分包括：溶解在沸点不高于 120 摄氏度的溶剂中的可溶性聚酰亚胺（A）；以及在一个分子中至少具有一个芳香环和至少两个双键的化合物（B），其中可溶性聚酰亚胺至少是从具有 1 至 6 个芳香环的酸酐或脂环酸酐和/或具有 1 至 6 个芳香环的二胺中获得的。阻焊层、覆盖层薄膜等具有优异的耐热性和机械性能，并且不会损坏基材，因为它们可以在相对较低的温度下层压。
• Photosensitive polyimide precursor and its use for pattern formation
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP0814109B1

  公开（公告）日：2004-08-18
• US6025113A
  申请人：——

  公开号：US6025113A

  公开（公告）日：2000-02-15
• US6087006A
  申请人：——

  公开号：US6087006A

  公开（公告）日：2000-07-11