Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
申请人:Matsushita Electric Industrial Co., Ltd.
公开号:US20040219372A1
公开(公告)日:2004-11-04
Provided are a composition for forming film which can form porous film excelling in dielectric constant, adhesiveness, uniformity of the film, mechanical strength and having low hygroscopicity; porous film and a method for forming the film; and a high-performing and highly reliable semiconductor device comprising the porous film inside. More specifically, provided is a composition for forming porous film, the composition comprising siloxane polymer and one or more quaternary ammonium salts represented by following formula (1) or (2):
[(R
1
)
4
N]+[R
2
X]
−
(1)
H
k
[(R
1
)
4
N]
m
+
Y
−
(2)
wherein X represents CO
2
, OSO
3
or SO
3
; Y represents SO
4
, SO
3
, CO
3
, O
2
C—CO
2
, NO
3
or NO
2
; and k is 0 or 1, m is 1 or 2 and n is 1 or 2 in proviso that n=1 requires k=0 and m=1, and n=2 requires k=O and m=2, or k=1 and m=1.
本发明提供了一种可形成介电常数、粘附性、薄膜均匀性、机械强度优异且吸湿性低的多孔薄膜的成膜组合物;多孔薄膜及其成膜方法;以及一种内部包含该多孔薄膜的高性能、高可靠性半导体器件。更具体地说,提供了一种用于形成多孔薄膜的组合物,该组合物包括硅氧烷聚合物和一种或多种由下式(1)或(2)表示的季铵盐:
[(R
1
)
4
N]+[R
2
X]
-
(1)
H
k
[(R
1
)
4
N]
m
+
Y
-
(2)
其中 X 代表 CO
2
、OSO
3
或 SO
3
Y 代表 SO
4
、SO
3
, CO
3
, O
2
C-CO
2
NO
3
或 NO
2
;且 k 为 0 或 1,m 为 1 或 2,n 为 1 或 2,但条件是 n=1 需要 k=0 和 m=1,n=2 需要 k=O 和 m=2,或 k=1 和 m=1。