COMPOSITION FOR FORMATION OF UNDERLAYER FILM FOR LITHOGRAPHY CONTAINING EPOXY COMPOUND AND CARBOXYLIC ACID COMPOUND
申请人:Nissan Chemical Industries, Ltd.
公开号:EP1617289A1
公开(公告)日:2006-01-18
There is provided an underlayer coating forming composition for lithography that is used in lithography process of manufacture of semiconductor device; and an underlayer coating having a high dry etching rate compared with photoresist. Concretely, it is a composition for forming an underlayer without use of crosslinking reaction by an strong acid catalyst, and an underlayer coating forming composition containing a component having an epoxy group (a polymer, a compound) and a component having a phenolic hydroxyl group, a carboxyl group, a protected carboxyl group or an acid anhydride structure (a polymer, a compound).
本发明提供了一种用于半导体设备制造的光刻工艺中的光刻用底层涂层形成组合物,以及一种与光刻胶相比干蚀刻率高的底层涂层。具体地说,它是一种无需使用强酸催化剂进行交联反应即可形成底层涂层的组合物,以及一种底层涂层形成组合物,该组合物包含具有环氧基的成分(聚合物、化合物)和具有酚羟基、羧基、保护羧基或酸酐结构的成分(聚合物、化合物)。