申请人:SENJU METAL INDUSTRY CO., LTD.
公开号:US10556299B2
公开(公告)日:2020-02-11
An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux.
The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and
0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.
本发明的目的是提供一种在焊接时可抑制桥和球发生的助焊剂,以及一种用于该助焊剂的树脂组合物。
该助焊剂包括:至少一种选自 0.3 至 2.0 质量%的有机氯化合物,以及大于 0.04 质量%和 1.00 质量%或更少的胺盐酸盐;和
0.2 至 1.5 质量%的有机磷化合物,至少选自膦酸酯和苯基取代膦酸中的一种,每种都以整个助熔剂为基础。