The present invention provides a silicone-containing copolymer molded article having a hydrophilic surface by means of the cast molding method and without employing a high-molecular-weight hydrophilic polymer even when employing a polypropylene mold. The silicone-containing copolymer molded article having a hydrophilic surface is prepared by polymerizing a monomer solution containing (a) a silicone monomer comprising a (meth)acryloyl group; (b) a hydrophilic monomer comprising a vinyl group; (c) a crosslinkable monomer; and (d) a polymerization initiator in a cavity of a mold having a hydrophobic cavity surface. The polymerization initiator has a 10-hour half-life temperature (T10) of 70 °C or higher and 100°C or lower, and the polymerization is conducted by means of a step P1 of maintaining a temperature within a range of from the T10 of the polymerization initiator contained in the monomer solution to 35°C below T10 for one hour or more; and a step P2 of maintaining a temperature higher than the T10 of the polymerization initiator contained in the monomer solution for one hour or more.
本发明提供了一种含
硅共聚物模制品,该模制品通过浇注成型法,即使使用聚
丙烯模具,也无需使用高分子量亲
水聚合物,即可获得具有亲
水性表面的模制品。制备具有亲
水性表面的含
硅共聚物模塑制品的方法是,在具有疏
水性模腔表面的模具模腔中聚合单体溶液,该单体溶液含有:(a) 含有(甲基
丙烯酰基)的有机
硅单体;(b) 含有
乙烯基的亲
水单体;(c) 可交联单体;以及 (d) 聚合
引发剂。聚合
引发剂的10小时半衰期温度(T10)为70℃或更高,100℃或更低,聚合是通过以下步骤进行的:步骤P1,将温度保持在单体溶液中所含聚合
引发剂的T10至低于T10的35℃的范围内一小时或更长时间;步骤P2,将温度保持在高于单体溶液中所含聚合
引发剂的T10的范围内一小时或更长时间。