4,4'-biphenyletherdicarbonyl diimidazole

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 英文名称: 4,4'-biphenyletherdicarbonyl diimidazole
• 英文别名: 1,1'-(4,4'-oxydibenzoyl)diimidazole；[4-[4-(Imidazole-1-carbonyl)phenoxy]phenyl]-imidazol-1-ylmethanone
• 化学式: C₂₀H₁₄N₄O₃
• 分子量: 358.356
• InChiKey: VSJVFIBYHFIODA-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.7
• 重原子数：
  27
• 可旋转键数：
  4
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  79
• 氢给体数：
  0
• 氢受体数：
  5

反应信息

• 作为产物：
  描述：

  咪唑 、 4,4’-二酰氯二苯醚 以 四氢呋喃 为溶剂， 反应 3.5h， 以66%的产率得到4,4'-biphenyletherdicarbonyl diimidazole
  参考文献：
  名称：

  JP5834390

  摘要：

  公开号：

文献信息

• Resin and photosensitive resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11174350B2

  公开（公告）日：2021-11-16

  A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.

  本发明提供了一种树脂和一种光敏树脂组合物，通过该树脂和组合物可以获得具有高延伸性、低应力和高金属粘附性的固化薄膜。一种树脂（A）包括聚酰胺结构和至少任何一种亚胺前体结构和亚胺结构，其中树脂（A）的至少任何一种结构包括具有脂肪族基团的二胺残基。
• Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11279802B2

  公开（公告）日：2022-03-22

  The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.

  本发明提供了一种碱溶性树脂，利用其可以获得具有高延伸性、低应力、对金属的高附着力以及高耐热性的固化膜，并提供含有该碱溶性树脂的光敏树脂组合物。本发明的碱溶性树脂(A)包含由通式(1)表示的结构，其中X1表示具有2至100个碳原子的二价有机基团，Y1和Y2各自表示具有2至100个碳原子的二价至六价有机基团，X2表示具有2至100个碳原子的四价有机基团，p和q各自表示0至4之间的整数，n1和n2各自表示5至100,000之间的整数，并且满足以下(I)和(II)条件： (I) 在通式(1)中，作为X1的含有具有8至30个碳原子的脂肪链的有机基团的含量基于X1和X2的总量为30至70摩尔%； (II) 在通式(1)中，作为Y1的含有二苯醚结构的有机基团的含量基于Y1和Y2的总量为1至30摩尔%。
• Resin composition
  申请人：TORAY INDUSTRIES, INC.

  公开号：US11347146B2

  公开（公告）日：2022-05-31

  The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.

  本发明是一种树脂组合物，包括(a)树脂、(b)抗氧化剂和(d)交联剂，其中树脂组合物的特征如下：树脂 (a) 由一种或多种树脂组成，这些树脂选自聚酰亚胺前体、聚酰胺、聚酰亚胺、聚苯并恶唑及其共聚物；以及 交联剂 (d) 包括一个分子中的酚羟基，还包括在酚羟基的两个正交位置上分子量大于或等于 40 的取代基。本发明提供了一种树脂组合物，通过该树脂组合物获得的图案固化膜可以获得精细的图案，在 250°C 或更低的低温下固化，同时表现出优异的面内图案均匀性，即使在经过实际使用加速试验的可靠性评估后，仍能保持高延伸性和与金属丝的高粘合性。
• METHOD FOR PRODUCING POLYAMIDE AND RESIN COMPOSITION
  申请人：Yuba Tomoyuki

  公开号：US20100285404A1

  公开（公告）日：2010-11-11

  Disclosed is a method for producing polyamide, wherein a diimidazolide compound represented by the general formula (1) shown below is reacted with a diamine compound represented by the general formula (2) shown below. The present invention provides a method for producing a chlorine-free high molecular weight alkali-soluble polyamide by simple process.
• RESIN AND PHOTOSENSITIVE RESIN COMPOSITION
  申请人：TORAY INDUSTRIES, INC.

  公开号：US20190081258A1

  公开（公告）日：2019-03-14

  A resin and a photosensitive resin composition whereby a cured film exhibiting high extensibility, reduced stress, and high adhesion to metals can be obtained are provided. A resin (A) including a polyamide structure and at least any structure of an imide precursor structure and an imide structure, wherein at least any of the structures of the resin (A) include a diamine residue having an aliphatic group.