phenyl 3-hydroxy-2-methylenepentanoate

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚酯
• 英文名称: phenyl 3-hydroxy-2-methylenepentanoate
• 英文别名: phenyl 3-hydroxy-2-methylenebutanoate；Phenyl 3-hydroxy-2-methylidenepentanoate；phenyl 3-hydroxy-2-methylidenepentanoate
• 化学式: C₁₂H₁₄O₃
• 分子量: 206.241
• InChiKey: FZEKJESZHOQWFO-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  15
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.25
• 拓扑面积：
  46.5
• 氢给体数：
  1
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  phenyl 3-hydroxy-2-methylenepentanoate 、 足球烯 在 4-二甲氨基吡啶 、 乙酸酐 作用下， 以 甲苯 为溶剂， 反应 1.5h， 以38%的产率得到
  参考文献：
  名称：

  組成物及び有機光電変換素子

  摘要：

  题目：具有优异光电转换效率的有机光电转换元件。 解决方案：包括式（1a）或式（1b）中表示的富勒烯衍生物的组合物。［其中，Ａ为富勒烯骨架；Ｒ1〜Ｒ7为Ｈ、卤素、氧基、烷基、芳基、杂环、脂环族、-（C=O）Q、-COOQ或（2）；n为1以上的整数；-｛（CH2）m-O｝qX（2）（其中，m为1〜6的整数；q为1〜4的整数；X为H、烷基或芳基）］。【无选图】。

  公开号：

  JP2016166152A
• 作为产物：
  描述：

  丙烯酸苯酯 、 丙醛 在 三乙烯二胺 作用下， 以 1,4-二氧六环 、 水 为溶剂， 反应 113.0h， 以33%的产率得到phenyl 3-hydroxy-2-methylenepentanoate
  参考文献：
  名称：

  Development of n-Type Semiconductor Based on Cyclopentene- or Cyclohexene-Fused [C₆₀]-Fullerene Derivatives

  摘要：

  Properties of cydopentene- or cyclohexene-fused [C-60]-fullerene derivatives as the acceptor in photovoltaic cells have been investigated by use of poly(3-hexylthiophene) (P3HT) as the model donor polymer. Several cyclopentene- or cyclohexene-fused [C-60]-fullerene derivatives show high power conversion efficiency (PCB). The highest PCE was obtained for 3',6'-dihydro-4'-phenoxycarbonyl-6'-methylbenzo[1,9][5,6] (C-60-I-h)fullerene (3.2%); this is superior to that of [C-60]-PCBM with the P3HT polymer under the same experimental conditions. PCE of the OPV devices with alkyl-substituted cydohexene-fused [C-60],fullerenes depended on the alkyl substituent on the cyclohexene ring; compounds with substituents of odd-number alkyl groups showed better PCE than those compounds possessing even-number alkyl groups.

  DOI：

  10.1021/acs.joc.5b00530

文献信息

• PRESSURE SENSITIVE ADHESIVE SHEET, METHOD OF PROTECTING SEMICONDUCTOR WAFER SURFACE AND METHOD OF PROCESSING WORK
  申请人：Lintec Corporation

  公开号：EP1589085A1

  公开（公告）日：2005-10-26

  An object of the present invention is to provide a pressure sensitive adhesive sheet that does not adhere to other apparatuses and the like, even when it is applied to a manufacturing including heat treatment or treatment involving heat generation. It is a further object of the present invention to provide a pressure sensitive adhesive sheet for semiconductor wafer processing or the like having unprecedented high-temperature heat resistance, which can be used as a surface protective sheet, a dicing sheet or a pickup sheet, by imparting properties such as protective function of a circuit surface or expanding properties. A pressure sensitive adhesive sheet according to the present invention is characterized by comprising a base material obtained by film-forming and curing a first curable resin, a top coat layer formed on the base material by coating and curing a second curable resin, and a pressure sensitive adhesive layer formed on the opposite side of the base material.

  本发明的一个目的是提供一种压敏胶片，即使将其应用于包括热处理或涉及发热的处理在内的制造中，也不会粘附到其他设备等。本发明的另一个目的是提供一种用于半导体晶片加工或类似用途的压敏胶片，它具有前所未有的高温耐热性，通过赋予诸如电路表面保护功能或膨胀性能等特性，可用作表面保护片、切割片或拾取片。根据本发明的压敏胶片，其特征在于包括通过成膜和固化第一固化树脂获得的基材、通过涂布和固化第二固化树脂在基材上形成的表层，以及在基材的反面形成的压敏胶层。
• LASER DICING SHEET AND METHOD FOR MANUFACTURING CHIP BODY
  申请人：Lintec Corporation

  公开号：EP2091073A1

  公开（公告）日：2009-08-19

  An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.

  本发明的目的是提供一种激光切割片，它能够防止激光束切割切割片、损坏卡盘工作台以及切割片与卡盘工作台的融合。 根据本发明，激光切割片包括由聚氨酯丙烯酸酯组成的基材；以及在其一个表面形成的粘合层。
• LASER DICING USING AN ADHESIVE SHEET
  申请人：Lintec Corporation

  公开号：EP2091073B1

  公开（公告）日：2017-03-01
• Pressure sensitive adhesive sheet, method of protecting semiconductor wafer surface and method of processing work
  申请人：Horigome Katsuhiko

  公开号：US20060134406A1

  公开（公告）日：2006-06-22

  Provided is a pressure sensitive adhesive sheet that does not adhere to other apparatuses, even when it is used in a manufacturing scheme using heat treatment or treatment involving heat generation. More particularly, the pressure sensitive adhesive sheet is suited for semiconductor wafer processing, possessing unprecedented high-temperature heat resistance. The pressure sensitive adhesive sheet can be used as a surface protective sheet, a dicing sheet or a pickup sheet, by imparting properties such as a protective function of an uneven circuit surface or expanding properties. The pressure sensitive adhesive sheet comprises a base material obtained by film-forming and curing a first curable resin, a top coat layer formed on the base material by coating and curing a second curable resin, and a pressure sensitive adhesive layer formed on the opposite side of the base material.
• LASER DICING SHEET AND PROCESS FOR PRODUCING CHIP BODY
  申请人：WAKAYAMA Yoji

  公开号：US20080190904A1

  公开（公告）日：2008-08-14

  An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. A laser dicing sheet according to the present invention comprising a base material comprising a polyurethane acrylate; and an adhesive layer formed on one surface thereof.