申请人:GENERAL ELECTRIC COMPANY
公开号:EP0945477A1
公开(公告)日:1999-09-29
Curable compositions used in circuit boards, structural composite, encapsulating resins, and the like, comprise at least one of a cyanate ester and a cyanate ester prepolymer, a cyanate ester-free aryloxytriazine, and a curing catalyst.
用于电路板、结构复合材料、封装树脂等的可固化组合物包括氰酸酯和氰酸酯预聚物、不含氰酸酯的芳氧基三嗪和固化催化剂中的至少一种。