1,1'-(5-甲基-1,3-亚苯基)二(1H-吡咯-2,5-二酮) | 39594-44-0

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡咯啉
• 中文名称: 1,1'-(5-甲基-1,3-亚苯基)二(1H-吡咯-2,5-二酮)
• 英文名称: N,N'-m-Tolylendimaleinimid
• 英文别名: 1,1'-(5-methyl-1,3-phenylene)bis-1H-pyrrole-2,5-dione；1-[3-(2,5-dioxopyrrol-1-yl)-5-methylphenyl]pyrrole-2,5-dione
• CAS: 39594-44-0
• 化学式: C₁₅H₁₀N₂O₄
• 分子量: 282.255
• InChiKey: VZAIEIIAJMQYPB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0.5
• 重原子数：
  21
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.07
• 拓扑面积：
  74.8
• 氢给体数：
  0
• 氢受体数：
  4

安全信息

• 海关编码：
  2925190090

文献信息

• Thermosetting resin composition, resin sheet, prepreg and laminated sheet
  申请人：NITTO DENKO CORPORATION

  公开号：EP0422379A2

  公开（公告）日：1991-04-17

  A thermosetting resin composition, and a resin sheet, a prepreg and a laminated sheet using the composition are disclosed, which composition comprises (A) an amine-terminated oligomer represented by formula (I): wherein Ar₁ represents a divalent aromatic group, Ar₂ represents a tetravalent aliphatic or aromatic group, and a represents an integer of at least 1; and (B) a polymaleimide represented by formula (II): wherein Ar₃ represents an aliphatic group having two or more carbon atoms or an aromatic group, and b represents an integer of at least 2, provided that a part or the whole of hydrogen atoms of at least one group of Ar₁, Ar₂ and Ar₃ in formulae (I) and (II) is substituted by fluorine atoms.

  本发明公开了一种热固性树脂组合物以及使用该组合物的树脂板、预浸料和层压板，该组合物包括 (A) 由式 (I) 表示的胺封端低聚物： 其中 Ar₁ 代表二价芳香族基团，Ar₂ 代表四价脂肪族或芳香族基团，a 代表至少 1 的整数；以及 (B) 由式 (II) 代表的聚马来酰亚胺： 其中 Ar₃ 代表具有两个或两个以上碳原子的脂肪族基团或芳香族基团，且 b 代表至少 2 的整数，条件是式(I)和(II)中 Ar₁、Ar₂ 和 Ar₃ 的至少一个基团的部分或全部氢原子被氟原子取代。
• Polyimides and thermosetting resin compositions containing the same
  申请人：Hitachi Chemical Co., Ltd.

  公开号：EP0456515A1

  公开（公告）日：1991-11-13

  1. A polyamide comprising repeating units of formula wherein    Ar is a divalent aromatic group;    X is -O- or and    R¹, R², R³ and R⁴ are the same or different and each is alkyl or alkoxyl having 1 to 4 carbon atoms has high solubility in organic solvents and good moldability at low temperatures, and can provide a thermosetting resin composition together with a polymaleimide.

  1.一种聚酰胺，由式如下的重复单元组成 其中 Ar 是二价芳香基团； X 是-O-或 和 R¹、R²、R³ 和 R⁴ 相同或不同，且各自为具有 1 至 4 个碳原子的烷基或烷氧基，具有在有机溶剂中的高溶解性和低温下的良好成型性，可与聚马来酰亚胺一起提供热固性树脂组合物。
• Methods of making thin-film wiring boards, thin-film wiring boards made thereby, and adhesive materials
  申请人：HITACHI, LTD.

  公开号：EP0552984A2

  公开（公告）日：1993-07-28

  A wiring board having plural layers is made by bonding together individual wiring sheets (1,11,21), each typically comprising copper wiring on a polyimide film substrate. The sheets are bonded together by applying a liquid varnish (16,26) to the wired surface (3) of one sheet. The varnish contains a polyimide precursor, preferably a polyamic acid ester, or a soluble polyimide, as well as a thermosetting adhesion promoter, preferably maleimide-terminated. The liquid varnish (16,26) is dried to a solid polyimide layer on the wired surface. A further wiring sheet is then pressed onto the polyimide layer and the adhesion promoter is polymerised by heating to bond the layers together.

  将单个布线片（1,11,21）粘合在一起可制成具有多层的布线板，每个布线片通常包括聚酰亚胺薄膜基板上的铜线。将液态清漆（16,26）涂抹在一张布线板的布线表面（3）上，即可将布线板粘合在一起。清漆含有聚酰亚胺前体（最好是聚酰胺酸酯）或可溶性聚酰亚胺，以及热固性粘合促进剂（最好是马来酰亚胺封端）。液态清漆（16,26）经干燥后在布线表面形成固态聚酰亚胺层。然后将另一层布线片压在聚酰亚胺层上，通过加热使附着力促进剂聚合，从而将各层粘合在一起。
• Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides
  申请人：HITACHI CHEMICAL CO., LTD.

  公开号：EP0553612A2

  公开（公告）日：1993-08-04

  A polyimide comprises structural units represented by the following formula: wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.

  聚酰亚胺包括下式所代表的结构单元： 其中 Ar 是由 10-90 摩尔%的第一种特定结构亚单元和 90-10 摩尔%的第二种特定结构亚单元组成的组。本发明还公开了聚酰亚胺的生产工艺以及包含聚酰亚胺和特定聚马来酰亚胺的热固性树脂组合物。
• Thermosetting resin compositions and their use for thin film wiring boards
  申请人：HITACHI, LTD.

  公开号：EP0618269A1

  公开（公告）日：1994-10-05

  The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10² to 10⁷ dyne/cm² in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.

  本发明涉及一种热固性树脂组合物，该组合物由(A)热固性聚酰亚胺和(B)双马来酰亚胺组成，在热固化步骤中显示出 10² 至 10⁷ 戴恩/平方厘米的弹性模量，适用于形成薄膜布线板中使用的胶膜，具有优异的耐热性和高可靠性。本发明还涉及前体化合物和组合物。