1,1-二甲基-3-(2-硝基苯基)脲 | 36894-29-8

• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 1,1-二甲基-3-(2-硝基苯基)脲
• 英文名称: 1,1-dimethyl-3-(2-nitrophenyl)urea
• 英文别名: N,N-dimethyl-N'-(2-nitro-phenyl)-urea；N,N-Dimethyl-N'-(2-nitro-phenyl)-harnstoff；N,N-Dimethyl-N'-<2-nitro-phenyl>-harnstoff；3,3-Dimethyl-1-(2-nitrophenyl)urea
• CAS: 36894-29-8
• 化学式: C₉H₁₁N₃O₃
• mdl: MFCD01034780
• 分子量: 209.205
• InChiKey: FRBHCWIPAUJHEP-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  15
• 可旋转键数：
  1
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.222
• 拓扑面积：
  78.2
• 氢给体数：
  1
• 氢受体数：
  3

安全信息

• 海关编码：
  2924299090

反应信息

• 作为反应物：
  描述：

  1,1-二甲基-3-(2-硝基苯基)脲 在 碘苯二乙酸 、 三氟乙酸 、 potassium bromide 作用下， 以 丙酮 为溶剂， 以44%的产率得到3-(4-bromo-2-nitrophenyl)-1,1-dimethylurea
  参考文献：
  名称：

  芳基脲与二碘苯基碘（III）和溴化钾的区域选择性溴化

  摘要：

  报道了一种利用PIDA和溴化钾的有效的区域选择性和操作简单的尿素溴化方法。在室温下，该方案对丙酮中的多种取代脲均有效，可形成对溴代化合物，收率为44–86％。

  DOI：

  10.1016/j.tet.2019.130621
• 作为产物：
  描述：

  非草隆 在 Iron(III) nitrate nonahydrate 、 copper(II) choride dihydrate 、 对甲苯磺酸 作用下， 以 甲苯 为溶剂， 以60%的产率得到1,1-二甲基-3-(2-硝基苯基)脲
  参考文献：
  名称：

  Cu（II）通过C–H官能化催化芳基尿素的邻位–C–H硝化

  摘要：

  提出了一种用Fe（NO 3）3 ·9H 2 O芳基尿素的芳族邻位碳氢硝化的新方案。该反应使用CuCl 2 ·2H 2 O作为催化剂，使用p -TSA作为添加剂，显示出良好的官能团耐受性，并以中等至极好的收率提供了所需的产物。

  DOI：

  10.1021/acs.joc.8b01016

文献信息

• Copper‐Catalyzed Mild Nitration of Protected Anilines
  作者：Elier Hernando、Rafael R. Castillo、Nuria Rodríguez、Ramón Gómez Arrayás、Juan C. Carretero

  DOI：10.1002/chem.201404000

  日期：2014.10.20

  A practical copper‐catalyzed direct nitration of protected anilines, by using one equivalent of nitric acid as the nitrating agent, has been developed. This procedure features mild reaction conditions, wide structural scope (with regard to both N‐protecting group and arene substitution), and high functional‐group tolerance. Dinitration with two equivalents of nitric acid is also feasible.

  通过使用一当量的硝酸作为硝化剂，已开发出一种实用的铜催化的被保护的苯胺直接硝化方法。该程序的特点是反应条件温和，结构范围广（就N保护基和芳烃取代​​而言）以及高官能团耐受性。用两当量的硝酸进行消解也是可行的。
• Composition for vibration damper, process for manufacture thereof, and vibration damper
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0328411A2

  公开（公告）日：1989-08-16

  A composition for a vibration damper, which comprises: 100 parts by weight of a resin-forming component comprising (a) a compound containing an epoxy group, and (b) a curing component comprising (i) a polyhydric phenol as a first curing compound and (ii) a second curing compound selected from the group consisting of an acid hydrazide, a urea derivative and an imidazole; 50 to 500 parts by weight of a scaly filler; 200 parts by weight or less of powdery filler; and 100 parts by weight or less of a fibrous filler. A process for the manufacture of the composition, and a vibration damper, also are disclosed.

  一种用于减震器的组合物，它包括 按重量计，100 份树脂形成组分，包括(a) 含环氧基团的化合物，和(b) 固化组分，包括(i) 作为第一固化化合物的多氢苯酚和(ii) 从酸酰肼、脲衍生物和咪唑组成的组中选出的第二固化化合物； 50 至 500 重量份的鳞片状填料； 以重量计，200 份或更少粉状填料；以及 100 份（重量）或更少的纤维状填料。此外，还公开了该组合物的制造工艺和减震器。
• Epoxy resin composition and semiconductor sealing material comprising same
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0379172A2

  公开（公告）日：1990-07-25

  Disclosed is an epoxy resin composition comprising, as basic components, (A) an epoxy resin, (B) a phenol-novolak resin, (C) a curing promotor and (D) a filler. Pulverized or spherical silica having specific particle size characteristics is used as the filler (D). Preferably, a halogenated epoxy resin and antimony oxide are further incorporated in this epoxy resin. This epoxy resin composition shows a very small molding shrinkage. If a dialkylurea derivative is used as the curing promotor (C), the stability of the composition at about 100°C is drastically improved and the flowability of the composition is improved. Accordingly, precision injection molding becomes possible, and the effect of sealing a semiconductor is enhanced.

  本发明公开了一种环氧树脂组合物，其基本成分包括：(A) 环氧树脂；(B) 苯酚-Novolak 树脂；(C) 固化促进剂；(D) 填料。填料 (D) 采用具有特定粒度特性的粉状或球状二氧化硅。环氧树脂中最好再加入卤化环氧树脂和氧化锑。这种环氧树脂组合物的成型收缩率非常小。如果使用二烷基脲衍生物作为固化促进剂 (C)，组合物在约 100°C 时的稳定性会大大提高，组合物的流动性也会得到改善。因此，精密注塑成型成为可能，密封半导体的效果也得到增强。
• A method of injection-molding an epoxy resin composition and an injection-moldable epoxy resin composition
  申请人：MITSUI PETROCHEMICAL INDUSTRIES, LTD.

  公开号：EP0810248A2

  公开（公告）日：1997-12-03

  A method of injection-molding an epoxy resin, which method comprises charging a mini-sprue metal mold comprising a manifold part, a mini-sprue part and an ejector-plate part with an epoxy resin composition possessing latent-type curing characteristics, maintaining the manifold part of the metal mold at a temperature at which the epoxy resin composition is molten but curing of the composition is not promoted, and then injection-molding the composition.

  一种注塑环氧树脂的方法，该方法包括在一个由分流板部分、迷你浇口部分和顶出板部分组成的迷你浇口金属模具中注入具有潜伏型固化特性的环氧树脂组合物，将金属模具的分流板部分保持在环氧树脂组合物熔融但不促进组合物固化的温度下，然后注塑组合物。
• EPOXY RESIN COMPOSITION AND ITS USE
  申请人：Mitsui Chemicals, Inc.

  公开号：EP1331244A1

  公开（公告）日：2003-07-30

  The epoxy resin composition according to the invention contains an epoxy resin and/or an epoxy compound, a curing agent, a curing accelerator and an inorganic filler as main components. The inorganic filler has a particle size of a maximum particle diameter of not more than 10 µm and a mean particle diameter of not more than 3 µm and a slope n of not more than 4.0 in its particle size distribution that is expressed by a Rosin-Rammler's (RRS) diagram, and is contained in the resin composition in an amount of not less than 30 % by weight and not more than 85 % by weight based on the total amount of the resin composition. The slope n is preferably not less than 1.0. The resin composition is preferable for transfer molding or injection molding. This composition is free from deterioration of moldability caused by lowering of flowability and is excellent in mold-transferring properties and excellent dimensional stability. Hence, the composition can provide a precision-molded article having excellent dimensional stability, such as a precision-molded component having a small degree of surface roughness and small circularity. By the use of the resin composition, a precision connector for optical communication, such as a single-core ferrule or a multi-core ferrule, can be produced as resin-made one. Further, the resin composition is excellent in mold-transferring properties and is capable of being injection molded. The precision-molded article according to the invention comprises the resin composition.

  根据本发明，环氧树脂组合物的主要成分包括环氧树脂和/或环氧化合物、固化剂、固化促进剂和无机填料。无机填料的最大粒径不超过 10 微米，平均粒径不超过 3 微米，其粒径分布的斜率 n 不超过 4.0（用罗辛-拉姆勒（RRS）图表示），其在树脂组合物中的含量不低于树脂组合物总量的 30%（重量百分比），不超过 85%（重量百分比）。斜率 n 最好不小于 1.0。该树脂组合物最好用于传递模塑或注射模塑。这种组合物不会因流动性降低而导致成型性变差，并具有优异的模具转移特性和出色的尺寸稳定性。因此，该组合物可以提供尺寸稳定性极佳的精密成型品，例如表面粗糙度小、圆度小的精密成型部件。通过使用该树脂组合物，可以生产出树脂制造的光通信用精密连接器，如单芯插芯或多芯插芯。此外，该树脂组合物还具有优异的脱模性能，可进行注塑成型。根据本发明，精密模塑制品包括树脂组合物。