(2E,5Z)-hepta-2,5-dienoic acid

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 英文名称: (2E,5Z)-hepta-2,5-dienoic acid
• 化学式: C₇H₁₀O₂
• 分子量: 126.15
• InChiKey: SODMOUXEPOJRRF-NDEAWQBTSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.6
• 重原子数：
  9
• 可旋转键数：
  3
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.29
• 拓扑面积：
  37.3
• 氢给体数：
  1
• 氢受体数：
  2

反应信息

• 作为反应物：
  描述：

  (2E,5Z)-hepta-2,5-dienoic acid 生成 (2R,3S)-3-[[(2R,3S)-3-methyloxiran-2-yl]methyl]oxirane-2-carboxylic acid
  参考文献：
  名称：

  PARRY, RONALD J.;TURAKHIA, RAJESH;BUU, HANH PHUOC, J. AMER. CHEM. SOC., 110,(1988) N 12, 4035-4036

  摘要：

  DOI：

文献信息

• PARRY, RONALD J.;TURAKHIA, RAJESH;BUU, HANH PHUOC, J. AMER. CHEM. SOC., 110,(1988) N 12, 4035-4036
  作者：PARRY, RONALD J.、TURAKHIA, RAJESH、BUU, HANH PHUOC

  DOI：——

  日期：——
• CLEANING COMPOSITIONS AND METHODS OF USE THEREOF
  申请人：Fujifilm Electronic Materials U.S.A., Inc.

  公开号：US20210292685A1

  公开（公告）日：2021-09-23

  The present disclosure relates to cleaning compositions that can be used to clean semiconductor substrates. These cleaning compositions can be used to remove defects arising from previous processing steps on these semiconductor substrates. These cleaning compositions can remove the defects/contaminants from the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one organic acid and at least one anionic polymer.
• [EN] CLEANING COMPOSITIONS AND METHODS OF USE THEREOF<br/>[FR] COMPOSITIONS DE NETTOYAGE ET LEURS PROCÉDÉS D'UTILISATION
  申请人：FUJIFILM ELECTRONIC MAT USA INC

  公开号：WO2021188766A1

  公开（公告）日：2021-09-23

  The present disclosure relates to cleaning compositions that can be used to clean semiconductor substrates. These cleaning compositions can be used to remove defects arising from previous processing steps on these semiconductor substrates. These cleaning compositions can remove the defects/contaminants from the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one organic acid and at least one anionic polymer.