申请人:——
公开号:US20020146639A1
公开(公告)日:2002-10-10
A lithographic photoresist composition is provided that can be used as a chemical amplification photoresist. In a preferred embodiment, the composition is substantially transparent to deep ultraviolet radiation, i.e., radiation of a wavelength less than
250
nm, including
157
nm,
193
nm and
248
nm radiation, and has improved sensitivity and resolution. The composition comprises a fluorinated vinylic polymer, particularly a fluorinated methacrylate, a fluorinated methacrylonitrile, or a fluorinated methacrylic acid, and a photoacid generator. The polymer may be a homopolymer or a copolymer. A process for using the composition to generate resist images on a substrate is also provided, i.e., in the manufacture of integrated circuits or the like.
提供了一种可用作化学放大光刻胶的光刻胶组合物。在优选实施例中,该组合物对深紫外辐射,即波长小于250nm的辐射,包括157nm、193nm和248nm辐射,具有改善的灵敏度和分辨率,并且基本透明。组合物包括一种氟化乙烯基聚合物,特别是氟化甲基丙烯酸酯、氟化甲基丙烯腈或氟化甲基丙烯酸,以及光酸发生剂。聚合物可以是均聚物或共聚物。还提供了一种使用该组合物在基板上生成光刻图像的工艺,即在集成电路或类似产品制造中使用。