A polyamino-oligomer comprising repeating units having an indan skeleton, prepared by the reaction of a diisopropenylbenzene or a bis(α-hydroxyisopropyl)benzene with an aniline in the presence of an acid catalyst. The oligomer is used as a curing agent for resins to be used for making laminates and, in addition, it is reacted with maleic anhydride to give a polymaleimide compound. This compound has a low melting or softening point and can provide a thermosetting resin composition suitable for manufacturing copper-clad laminates by compounding with a reactant which forms a three-dimensional cross-linkage, such as triallyl isocyanurate or an aromatic diamine. The obtained laminate is lowly dielectric, heat-resistant and lowly water-absorbent, and is useful for making multilayer printed wiring boards.
一种聚
氨基低聚物,由具有
茚骨架的重复单元组成,由
二异丙苯或双(α-羟基异丙基)苯与
苯胺在酸催化剂存在下反应制备而成。这种低聚物可用作制造层压板的
树脂的固化剂,此外,它还可与
马来酸酐反应生成聚马来
酰亚胺化合物。这种化合物具有较低的熔点或软化点,通过与形成三维交联的反应物(如异
氰尿酸三烯丙酯或芳香族二胺)进行复配,可以得到一种适用于制造覆
铜板的热固性
树脂组合物。得到的层压板具有低介电、耐热和低吸
水性的特点,可用于制造多层印刷线路板。