ORGANIC INSULATING MATERIAL, VARNISH FOR ORGANIC INSULATING FILM USING THE SAME, ORGANIC INSULATING FILM AND SEMICONDUCTOR DEVICE
申请人:Sumitomo Bakelite Co., Ltd.
公开号:EP2117009A1
公开(公告)日:2009-11-11
There are provided organic insulating materials exhibiting low permittivity, high heat resistance and high mechanical strength, as well as organic insulating films with low permittivity, high heat resistance and high mechanical strength that employ the same, and semiconductor devices comprising the foregoing. An organic insulating material comprising a compound represented by general formula (1), or a polymer obtained by polymerizing a compound represented by general formula (1), or a mixture of a compound represented by general formula (1) and the polymer.
(In formula (1), X and Y each independently represent one or more groups with polymerizable functional groups. V and W each represent a group having an adamantane or polyamantane structure, and they may be the same or different. The letter n represents an integer of 0 or greater.)
本发明提供了具有低介电常数、高耐热性和高机械强度的有机绝缘材料,以及具有低介电常数、高耐热性和高机械强度的有机绝缘薄膜,以及包含上述材料的半导体器件。一种有机绝缘材料,包括通式(1)所代表的化合物,或通过聚合通式(1)所代表的化合物而得到的聚合物,或通式(1)所代表的化合物与聚合物的混合物。
式(1)中,X 和 Y 各自独立地代表一个或多个具有可聚合官能团的基团。V 和 W 各自代表具有金刚烷或聚金刚烷结构的基团,它们可以相同或不同。字母 n 代表 0 或更大的整数)。