2,2,3,4,4-五氯-3-丁烯酸丁酯 | 75147-20-5

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 中文名称: 2,2,3,4,4-五氯-3-丁烯酸丁酯
• 英文名称: 3-Butenoic acid, 2,2,3,4,4-pentachloro-, butyl ester
• 英文别名: butyl 2,2,3,4,4-pentachlorobut-3-enoate
• CAS: 75147-20-5
• 化学式: C₈H₉Cl₅O₂
• 分子量: 314.4
• InChiKey: JZJILZTVTMMGAR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.9
• 重原子数：
  15
• 可旋转键数：
  6
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.62
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• Method of removing catalyst from ethylene-alpha-olefin copolymer
  申请人：SUMITOMO CHEMICAL COMPANY, LIMITED

  公开号：EP0490672A2

  公开（公告）日：1992-06-17

  After a copolymer of ethylene and an alpha-olefin of at least 3 carbon atoms (e.g. propylene) and optionally also a non-conjugated diene has been prepared with the use of a vanadium catalyst and an organoaluminum (e.g. alkyl) compound, the residual catalyst is removed from the polymerisation reaction mixture in a hydrocarbon solvent (e.g. hexane) by (a) when the catalyst also includes a halogenated ester compound, mixing the reaction mixture with stirring into an aqueous solution of an alkaline compound (e.g. hydroxide of Li, Na or K) in an amount to give an aqueous phase pH of at least 10; or (b) the halogenated ester compound being optional, oxidising the reaction mixture with an oxidising agent (preferably O₂), e.g. to convert the vanadium to pentavalent V, in an aqueous alkaline solution as in (a). The organic phase is then separated and washed with water and the polymer is recovered therefrom. The catalyst residue is thus reduced to very low levels, so that the copolymer is not affected thereby.

  在使用钒催化剂和有机铝（如烷基）化合物制备出乙烯和至少 3 个碳原子的 α-烯烃（如丙烯）以及非共轭二烯的共聚物后，在烃类溶剂（如己烷）中通过以 下方法从聚合反应混合物中除去残留的催化剂 (a) 当催化剂还包括卤代酯化合物时，在搅拌下将反应混合物混入碱性化合物（如 Li、Na 或 K 的氢氧化物）的水溶液中，其用量应使水相 pH 值至少为 10；或 (b) 卤化酯化合物是可选的，在碱性水溶液中用氧化剂（最好是 O₂）氧化反应混 合物，例如将钒转化为五价钒，如 (a) 所述。 然后分离有机相并用水洗涤，从中回收聚合物。 这样，催化剂的残留量就降到了很低的水平，从而使共聚物不受影响。
• Colorable non-sticky resin, prepolymerized catalyst, and processes for making them
  申请人：UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION

  公开号：EP0704464A2

  公开（公告）日：1996-04-03

  A colorable resin particle having an outer shell of a non-sticky polymer and an inner core of a sticky polymer produced in a gas phase fluidized bed reactor at or above the sticking temperature of the sticky polymer using a non-sticky prepolymerized catalyst and processes for producing the colorable resin and the non-sticky prepolymerized catalyst.

  一种可着色树脂颗粒，其外壳为非粘性聚合物，内核为粘性聚合物，在气相流化床反应器中使用非粘性预聚催化剂，在粘性聚合物的粘着温度或高于粘着温度的条件下生产，以及生产该可着色树脂和非粘性预聚催化剂的工艺。
• Process for controlling particle growth during production of sticky polymers
  申请人：UNION CARBIDE CHEMICALS & PLASTICS TECHNOLOGY CORPORATION

  公开号：EP0735058A1

  公开（公告）日：1996-10-02

  A process for controlling the particle growth of a polymer in a gas phase polymerization reaction by using an inert particulate material and an unsupported liquid polymerization catalyst.

  一种利用惰性颗粒材料和无支撑液态聚合催化剂控制聚合物在气相聚合反应中颗粒生长的工艺。
• Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive
  申请人：Sumitomo Bakelite Co., Ltd.

  公开号：EP2264113A2

  公开（公告）日：2010-12-22

  To provide a temporary bonding adhesive for a semiconductor wafer that can reduce damage to the semiconductor wafer, is easily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using the same. A temporary bonding adhesive for a semiconductor device is provided, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition such that the difference between the 95% weight loss temperature and the 5% weight loss temperature is1degree Celsius≤95%weight loss temperature-5%weight loss temperature≤300degrees Celsius.

  提供一种可减少对半导体晶片的损坏、易于分离并可缩短热分解所需时间的半导体晶片用临时粘接剂，以及使用该粘接剂的半导体器件的制造方法。 本发明提供了一种半导体器件用临时接合粘合剂，它是一种临时接合粘合剂，用于在加工半导体晶片时将半导体晶片临时接合在支撑基板上，以及在加工后通过加热将半导体晶片从支撑基板上分离，它含有树脂成分，其95%失重温度与5%失重温度之差为1摄氏度≤95%失重温度-5%失重温度≤300摄氏度。
• TEMPORARILY FIXING AGENT FOR SEMICONDUCTOR WAFER, AND PROCESS FOR PRODUCTION OF SEMICONDUCTOR DEVICE USING SAME
  申请人：Sumitomo Bakelite Company Limited

  公开号：EP2351805A1

  公开（公告）日：2011-08-03

  To provide a temporary bonding adhesive for a semiconductor wafer that can reduce damage to the semiconductor wafer, is easily detachable, and can shorten the time required for thermal decomposition, and a manufacturing method for a semiconductor device using the same. A temporary bonding adhesive for a semiconductor device is provided, being a temporary bonding adhesive used for temporarily bonding a semiconductor wafer onto a supporting substrate in order to process a semiconductor wafer, and for detaching a semiconductor wafer from a supporting substrate by heating after processing, containing a resin composition such that the difference between the 95% weight loss temperature and the 5% weight loss temperature is 1 degree Celsius ≤ (95% weight loss temperature) - (5% weight loss temperature) ≤ 300 degrees Celsius.

  提供一种可减少对半导体晶片的损坏、易于分离并可缩短热分解所需时间的半导体晶片用临时粘接剂，以及使用该粘接剂的半导体器件的制造方法。 本发明提供了一种用于半导体器件的临时粘接剂，它是一种临时粘接剂，用于在加工半导体晶片时将半导体晶片临时粘接在支撑基板上，以及在加工后通过加热将半导体晶片从支撑基板上剥离，它含有一种树脂成分，使 95% 失重温度与 5% 失重温度之差为 1 摄氏度 ≤ (95% 失重温度) - (5% 失重温度) ≤ 300 摄氏度。