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2-(1-苄基四唑-5-基)乙酸 | 64953-18-0

中文名称
2-(1-苄基四唑-5-基)乙酸
中文别名
——
英文名称
(1-Benzyl-2H-tetrazol-5-yl)essigsaeure
英文别名
(1-benzyl-1H-tetrazol-5-yl)-acetic acid;(1-Benzyl-1H-tetrazol-5-yl)acetic acid;2-(1-benzyltetrazol-5-yl)acetic acid
2-(1-苄基四唑-5-基)乙酸化学式
CAS
64953-18-0
化学式
C10H10N4O2
mdl
——
分子量
218.215
InChiKey
ZKNAPHWBCZSHKN-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 沸点:
    524.5±39.0 °C(Predicted)
  • 密度:
    1.39±0.1 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    0.7
  • 重原子数:
    16
  • 可旋转键数:
    4
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.2
  • 拓扑面积:
    80.9
  • 氢给体数:
    1
  • 氢受体数:
    5

SDS

SDS:1733bda894b4b9e89b36a87a4cc40769
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上下游信息

  • 上游原料
    中文名称 英文名称 CAS号 化学式 分子量

反应信息

点击查看最新优质反应信息

文献信息

  • Synthesis Optimization, Scale-Up, and Catalyst Screening Efforts toward the MGAT2 Clinical Candidate, BMS-963272
    作者:James Kempson、Xiaoping Hou、Jung-Hui Sun、Michael Wong、Joseph Pawluczyk、Jianqing Li、Subramaniam Krishnananthan、Eric M. Simmons、Yi Hsiao、Yi-Xin Li、Dawn Sun、Dauh-Rurng Wu、Wei Meng、Saleem Ahmad、Lidet Negash、Robert Brigance、Huji Turdi、Jon J. Hangeland、R. Michael Lawrence、Pratik Devasthale、Jeffrey A. Robl、Arvind Mathur
    DOI:10.1021/acs.oprd.2c00036
    日期:2022.4.15
    This paper describes the efficient scale-up synthesis of 1 (BMS-963272) which relies upon a highly selective Mannich-type alkylation strategy to stereospecifically install a quaternary carbon center. An intramolecular cyclization reaction is also used to form the aryl dihydropyridone (ADHP) core. The optimized route has been demonstrated to provide more than 100 g of active pharmaceutical ingredient
    本文描述了1 (BMS-963272) 的有效放大合成,该合成依赖于高选择性曼尼希型烷基化策略以立体定向安装季碳中心。分子内环化反应也用于形成芳基二氢吡啶酮 (ADHP) 核心。已证明优化的路线可为临床前毒理学评估提供超过 100 g 的活性药物成分。作为互补收敛方法的一部分,还讨论了催化剂筛选工作,这将有助于更方便地评估在 ADHP 核心的 C4 位具有芳基多样性的备用分子。
  • Synthesis of 2-(Tetrazolylacetyl)cyclohexane-1,3-diones
    作者:T. S. Khlebnicova、V. G. Zinovich、Yu. A. Piven、A. V. Baranovsky、F. A. Lakhvich、R. E. Trifonov
    DOI:10.1134/s1070363221080028
    日期:2021.8
  • Aqueous polishing liquid and chemical mechanical polishing method
    申请人:Kato Tomo
    公开号:US20070069176A1
    公开(公告)日:2007-03-29
    An aqueous polishing liquid is provided that includes an oxidizing agent, a five-membered monocyclic compound having at least three nitrogen atoms or a compound in which a hetero ring is fused to said compound, and a compound having an imidazole skeleton or an isothiazolin-3-one skeleton. The five-membered monocyclic compound having at least three nitrogen atoms and/or the compound in which a hetero ring is fused to said compound is used at a total concentration of less than 300 mg/L, and the compound having an imidazole skeleton or an isothiazolin-3-one skeleton is used at a concentration of at least 10 mg/L but no greater than 500 mg/L. There is also provided a chemical mechanical polishing method that includes a step of polishing by making a surface to be polished and a polishing surface move relative to each other while being in contact with each other in the presence of the aqueous polishing liquid.
  • Metal-polishing liquid and chemical mechanical polishing method using the same
    申请人:Yamashita Katsuhiro
    公开号:US20070186484A1
    公开(公告)日:2007-08-16
    The invention provides a metal polishing liquid comprising an oxidizing agent and colloidal silica in which a part of a surface of the colloidal silica is covered with aluminum atoms, and a Chemical Mechanical Polishing method using the same. An amino acid, a compound having an isothiazoline-3-one skeleton, an organic acid, a passivated film forming agent, a cationic surfactant, a nonionic surfactant, and a water-soluble polymer may be contained. A metal polishing liquid which is used in Chemical Mechanical Polishing in manufacturing of a semiconductor device, attains low dishing of a subject to be polished, and can perform polishing excellent in in-plane uniformity of a surface to be polished.
  • POLISHING COMPOSITION AND METHOD OF POLISHING WITH THE SAME
    申请人:Takenouchi Kenji
    公开号:US20070287362A1
    公开(公告)日:2007-12-13
    A polishing composition comprises: at least one compound selected from tetrazole compounds and derivatives thereof and anthranilic acid compounds and derivatives thereof; abrasive particles comprising associative abrasive particles; and an oxidizing agent.
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