Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device
申请人:TORAY INDUSTRIES, INC.
公开号:US11279802B2
公开(公告)日:2022-03-22
The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X1 represents a divalent organic group having 2 to 100 carbon atoms, Y1 and Y2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n1 and n2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X1 and X2, and (II) an organic group having a diphenyl ether structure is contained as Y1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y1 and Y2.
本发明提供了一种碱溶性树脂,利用其可以获得具有高延伸性、低应力、对金属的高附着力以及高耐热性的固化膜,并提供含有该碱溶性树脂的光敏树脂组合物。本发明的碱溶性树脂(A)包含由通式(1)表示的结构,其中X1表示具有2至100个碳原子的二价有机基团,Y1和Y2各自表示具有2至100个碳原子的二价至六价有机基团,X2表示具有2至100个碳原子的四价有机基团,p和q各自表示0至4之间的整数,n1和n2各自表示5至100,000之间的整数,并且满足以下(I)和(II)条件:
(I) 在通式(1)中,作为X1的含有具有8至30个碳原子的脂肪链的有机基团的含量基于X1和X2的总量为30至70摩尔%;
(II) 在通式(1)中,作为Y1的含有二苯醚结构的有机基团的含量基于Y1和Y2的总量为1至30摩尔%。