2-(4,6-二氨基-1,3,5-三嗪-2-基)乙基-2-甲基-2-丙烯酸酯 | 106241-72-9

• 物质功能分类: 有机原料 - 羧酸类化合物及衍生物 - 羧酸酯及其衍生物
• 分子结构分类: 有机化合物 - 有机杂环化合物 - 三嗪类
• 中文名称: 2-(4,6-二氨基-1,3,5-三嗪-2-基)乙基-2-甲基-2-丙烯酸酯
• 中文别名: 2,4-二氨基-6-(异丁烯酰氧基)乙基-1,3,5-三嗪
• 英文名称: 2-(4,6-Diamino-1,3,5-triazin-2-yl)ethyl 2-methylprop-2-enoate
• CAS: 106241-72-9
• 化学式: C₉H₁₃N₅O₂
• 分子量: 223.23
• InChiKey: HHOJVZAEHZGDRB-UHFFFAOYSA-N

物化性质

• 沸点：
  504.7±52.0 °C(Predicted)
• 密度：
  1.306±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  0.4
• 重原子数：
  16
• 可旋转键数：
  5
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.33
• 拓扑面积：
  117
• 氢给体数：
  2
• 氢受体数：
  7

文献信息

• Infrared ray absorbing composition or infrared ray absorbing composition kit, infrared ray cut filter using the same, method for producing the infrared ray cut filter, camera module, and method for producing the camera module
  申请人：FUJIFILM Corporation

  公开号：US10036838B2

  公开（公告）日：2018-07-31

  An infrared ray absorbing composition kit comprises: a composition containing a copper compound or pigment having a maximum absorption wavelength in the wavelength range of 700 nm to 1000 nm; and a composition containing a metal oxide having a maximum absorption wavelength in the wavelength range of 800 nm to 2000 nm.

  一种红外线吸收组合物套装包括：含有在700 nm至1000 nm波长范围内具有最大吸收波长的铜化合物或颜料的组合物；以及含有在800 nm至2000 nm波长范围内具有最大吸收波长的金属氧化物的组合物。
• PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF AND PRINTED CIRCUIT BOARD OBTAINED USING THE SAME
  申请人：KATO Kenji

  公开号：US20080096133A1

  公开（公告）日：2008-04-24

  A photocurable and thermosetting resin composition comprising (A) a carboxyl-group containing resin, (B) an oxime ester-based photopolymerization initiator containing an oxime ester group, (C) an aminoacetophenone-based photopolymerization initiator and/or a phosphine oxide-based photopolymerization initiator, (D) a compound having at least two ethylenically unsaturated groups in its molecule, (E) a filler, and (F) a thermosetting component is capable of being developed with a dilute alkaline solution and cured with a laser emission source having a maximum wavelength of 350 nm to 420 nm.

  一种光固化和热固化的树脂组合物，包括（A）含有羧基的树脂，（B）含有氧肟酯基团的光聚合引发剂，（C）基于氨基苯甲酮的光聚合引发剂和/或基于膦氧化物的光聚合引发剂，（D）分子中至少有两个乙烯基未饱和基团的化合物，（E）填料，以及（F）热固性组分，能够通过稀碱溶液进行显影并通过最大波长为350nm至420nm的激光发射源进行固化。
• CARBOXYL RESIN, HARDENING COMPOSITION CONTAINING CARBOXYL RESIN, AND HARDENED MATERIAL THEREOF
  申请人：Ikegami Koichi

  公开号：US20110082229A1

  公开（公告）日：2011-04-07

  A carboxyl resin according to the present invention is obtained by a process including following steps: epoxy groups on a resin (a) having two or more epoxy groups in one molecule is made to react with 0.3-0.85 mol of a monocarboxylic acid (b) per one epoxy-group equivalent weight to obtain a reaction product (c); the epoxy group or groups on the reaction product (c) are made to react with 0.15-0.95 mol of a polybasic acid (d) per one epoxy-group equivalent weight to obtain a reaction product (e); and the epoxy group or groups on the reaction product (e) are further made to react with 1.0-5.0 mol of a monocarboxylic acid (f) per one epoxy-group equivalent weight. The carboxyl resin thus obtained has an acid value within a range from 20 to 200 mgKOH/g and is soluble in an organic solvent.

  根据本发明，通过以下步骤获得一种羧基树脂：将具有一个分子中两个或更多环氧基团的树脂（a）上的环氧基团与0.3-0.85摩尔的单羧酸（b）反应，以获得反应产物（c）；将反应产物（c）上的环氧基团与0.15-0.95摩尔的多元酸（d）反应，以获得反应产物（e）；将反应产物（e）上的环氧基团与1.0-5.0摩尔的单羧酸（f）进一步反应。因此获得的羧基树脂酸值在20至200mgKOH/g范围内，并且可溶于有机溶剂。
• One-package type photosolder resist composition developable with aqueous alkali solution and method for production of printed circuit board by use thereof
  申请人：TAIYO INK MANUFACTURING CO. LTD.

  公开号：EP0747770A2

  公开（公告）日：1996-12-11

  A one-package type photosolder resist developable with an aqueous alkali solution and suitable for use as a solder resist for a printed circuit board is disclosed. The composition comprises (A) a copolymeric macromolecular compound containing at least one free carboxyl group in the molecular unit thereof or (A') a copolymeric macromolecular compound containing at least one free carboxyl group and at least one photoreactive unsaturated group in the molecular unit thereof and assuming a solid state at normal room temperature, (B) a diluent including a polyfunctional unsaturated compound assuming a liquid state at normal room temperature and/or an organic solvent, (C) a photopolymerization initiator, (D) a vinyltriazine compound or a derivative thereof, and (E) an inorganic filler. A process for forming a solder resist on a printed circuit board having a circuit preparatorily formed thereon comprises the steps of applying to the surface of said printed circuit board the one-package type photosolder resist composition mentioned above, drying the applied layer of said composition, selectively exposing the dried layer to actinic radiation according to a prescribed pattern, developing the unexposed area of said layer with an aqueous alkali solution thereby forming a solder resist pattern, and finally curing said resist pattern by exposure to actinic radiation.

  本发明公开了一种可使用碱水溶液显影并适合用作印刷电路板阻焊剂的单组分型光阻。该组合物包括 (A) 共聚高分子化合物，其分子单元中至少含有一个游离羧基，或 (A') 共聚高分子化合物，其分子单元中至少含有一个游离羧基和至少一个光活性不饱和基团，在常温下呈固态、(B) 稀释剂，包括在常温下呈液态的多官能团不饱和化合物和/或有机溶剂； (C) 光聚合引发剂； (D) 乙烯基三嗪化合物或其衍生物；以及 (E) 无机填料。在印刷电路板上形成阻焊层的工艺包括以下步骤：将上述单组分型光阻组合物涂在印刷电路板的表面上，干燥涂有上述组合物的层，按照规定的模式有选择地将干燥层暴露在光辐射下，用碱水溶液显影上述层的未暴露区域，从而形成阻焊层图案，最后通过暴露在光辐射下固化上述阻焊层图案。
• CARBOXYLATED PHOTOSENSITIVE RESIN, ALKALI-DEVELOPABLE PHOTOCURABLE/HEAT-CURABLE COMPOSITION CONTAINING THE SAME, AND CURED ARTICLE OBTAINED THEREFROM
  申请人：Taiyo Ink Manufacturing Co. Ltd

  公开号：EP1327642A1

  公开（公告）日：2003-07-16

  A carboxyl group-containing photosensitive resin is obtained by reacting an unsaturated group-containing monocarboxylic acid (d) with a reaction product (c) of a phenolic novolak resin (a) and an alkylene oxide (b) and further reacting a polybasic acid anhydride (f) with the resultant reaction product (e). A photocurable and thermosetting composition comprising (A) this carboxyl group-containing photosensitive resin, (C) a photopolymerization initiator, and (D) an epoxy resin, or further comprising (B) a photosensitive (meth)acrylate compound, preferably further comprising (E) an organic solvent and/or (F) a curing catalyst is capable of forming an image by irradiation of ultraviolet light and development with a dilute aqueous alkali solution and also capable of forming a cured film by means of final curing by heating, or by irradiation with active energy rays and subsequent heating, or by heating and subsequent irradiation with active energy rays. It is useful as an ultraviolet-curable type printing ink, various resists and interlaminar insulating materials to be used in the manufacture of printed circuit boards, or the like.

  将含不饱和基团的单羧酸（d）与酚醛树脂（a）和环氧亚烷基（b）的反应产物（c）进行反应，再将多碱性酸酐（f）与反应产物（e）进行反应，即可得到含羧基的感光树脂。一种光固化和热固性组合物，包括 (A) 含羧基的光敏树脂、(C) 光聚合引发剂和 (D) 环氧树脂，或进一步包括 (B) 光敏（甲基）丙烯酸酯化合物、最好还包括（E）有机溶剂和/或（F）固化催化剂，它能通过紫外线照射和稀碱水溶液显影形成图像，还能通过加热最终固化、或通过活性能量射线照射和随后加热、或通过加热和随后活性能量射线照射形成固化膜。它可用作紫外线固化型印刷油墨、各种抗蚀剂和层间绝缘材料，用于制造印刷电路板等。