There are provided a novel resin having a fluorene structure which has a relatively high carbon concentration in the resin, which has a relatively high heat resistance and also a relatively high solvent solubility, and which can be applied to a wet process, and a method for producing the resin, as well as a material for forming an underlayer film useful for forming a novel resist underlayer film excellent in heat resistance and etching resistance as an underlayer film for multilayer resist, and a pattern forming method using the material. The resin of the present invention has a structure represented by the following general formula (1).
(in the general formula (1), each of R3 and R4 independently denotes a benzene ring or a naphthalene ring, a carbon atom at the bridgehead of a fluorene backbone or (di)benzofluorene backbone is bonded with a carbon atom of each of other aromatic rings, and a carbon atom of each of aromatic rings of a fluorene backbone or (di)benzofluorene backbone is bonded with a carbon atom at the bridgehead of other fluorene backbone or (di)benzofluorene backbone.)
本发明提供了一种具有
芴结构的新型
树脂,该
树脂中的
碳浓度相对较高,具有相对较高的耐热性和相对较高的溶剂溶解性,可应用于湿法工艺,还提供了一种生产该
树脂的方法,以及一种用于形成底层膜的材料,该底层膜可用于形成耐热性和耐蚀刻性优异的新型抗蚀剂底层膜,作为多层抗蚀剂的底层膜,还提供了一种使用该材料的图案形成方法。本发明的
树脂具有以下通式 (1) 所表示的结构。
(在通式(1)中,R3 和 R4 各自独立地表示
苯环或
萘环,
芴骨架或(二)
苯并
芴骨架桥头的一个
碳原子与其他每个芳香环的一个
碳原子键合、
芴骨架或(二)
苯并
芴骨架的每个芳香环的
碳原子与其他
芴骨架或(二)
苯并
芴骨架桥头的
碳原子键合。)