Polymer compound, surface treatment agent, laminated body using surface treatment agent, transistor, method for manufacturing laminated body
申请人:NIKON CORPORATION
公开号:US10550281B2
公开(公告)日:2020-02-04
Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group].
POLYMER COMPOUND, SURFACE TREATMENT AGENT, LAMINATED BODY USING SURFACE TREATMENT AGENT, TRANSISTOR, METHOD FOR MANUFACTURING LAMINATED BODY
申请人:NIKON CORPORATION
公开号:US20170321079A1
公开(公告)日:2017-11-09
Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (
1
). [In formula (
1
), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group.]