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1,1'-Methylenebis(4-azido-3-chlorobenzene) | 75758-16-6

中文名称
——
中文别名
——
英文名称
1,1'-Methylenebis(4-azido-3-chlorobenzene)
英文别名
1-azido-4-[(4-azido-3-chlorophenyl)methyl]-2-chlorobenzene
1,1'-Methylenebis(4-azido-3-chlorobenzene)化学式
CAS
75758-16-6
化学式
C13H8Cl2N6
mdl
——
分子量
319.15
InChiKey
SMLJVSXMHSUQPA-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    7
  • 重原子数:
    21
  • 可旋转键数:
    4
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.08
  • 拓扑面积:
    28.7
  • 氢给体数:
    0
  • 氢受体数:
    4

文献信息

  • Radiation-sensitive composition and pattern-formation method using the same
    申请人:Hitachi, Ltd.
    公开号:EP0070198A1
    公开(公告)日:1983-01-19
    A radiation-sensitive composition comprising (i) an iodine-containing azide compound at least a part of which can be fixed substantially in a polymer by exposure to radiation and a polymer, or (ii) an azide compound, and an iodine compound at least a part of which can be fixed substantially in a polymer by exposure to a radiation and a polymer; and a said polymer substantially having compatibility with the azide compound in case (i) or the azide compound and the iodine compound in case (ii). This composition can be subjected to dry development with oxygen plasma after the exposure followed by heating, or it can be developed with an aqueous alkaline solution if the polymer is soluble therein.
    一种对辐射敏感的组合物,包括:(i) 含碘叠氮化合物,其中至少有一部分可通过辐射和聚合物的照射而基本固定在聚合物中,或 (ii) 叠氮化合物和碘化合物,其中至少有一部分可通过辐射和聚合物的照射而基本固定在聚合物中;以及所述聚合物与(i)情况下的叠氮化合物或(ii)情况下的叠氮化合物和碘化合物基本相容。这种组合物可以在曝光后用氧等离子体进行干显影,然后加热;如果聚合物可溶于碱性水溶液,也可以用碱性水溶液显影。
  • Photosensitive resin composition and process for forming photo-resist pattern using the same
    申请人:NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    公开号:EP0164598A2
    公开(公告)日:1985-12-18
    The present invention provides a photosensitive resin composition used to form a top resist layer of a multilayer resist system, the composition comprising a photosensitive polyphenylsilsesquioxane represented by the following general formula (I) of: wherein X is the one selected from the group consisting of acryloyloxymethyl, methacryloyloxymethyl, and cinnamoyloxymethyl; and I, m and n are zero or positive integers but I and m do not take the value of zero simultaneously; and a bisazide compound added to act as a cross-linking agent. The photosensitive resin composition has high sensitivity to UV lights and excellent resistance to reactive ion etching under oxygen gas (O2 RIE).
    本发明提供了一种用于形成多层抗蚀剂体系顶层抗蚀层的光敏树脂组合物,该组合物包括由以下通式(I)表示的光敏聚苯基硅倍半氧烷:其中,X是从丙烯酰氧基甲基、甲基丙烯酰氧基甲基和肉桂酰氧基甲基组成的组中选出的一个;I、m和n为零或正整数,但I和m不同时取值为零;以及添加的用作交联剂的双氮化合物。 该光敏树脂组合物对紫外线具有高灵敏度,对氧气(O2 RIE)下的活性离子蚀刻具有优异的耐受性。
  • Radiation-sensitive resin composition
    申请人:JAPAN SYNTHETIC RUBBER CO., LTD.
    公开号:EP0211667A2
    公开(公告)日:1987-02-25
    A radiation-sensitive resin composition comprises a solution of an alkali-soluble resin and a radiation-sensitive compound in a solvent comprising a monooxymonocarboxylic acid ester. This composition has a high storgage stability (i.e., a very small amount of fine particles are formed during storage) and is suited for use as a resist for making integrated circuits.
    一种辐射敏感树脂组合物由一种碱溶性树脂和一种辐射敏感化合物在一种由单氧一羧酸酯组成的溶剂中的溶液组成。 这种组合物具有很高的储存稳定性(即在储存过程中形成极少量的细小颗粒),适合用作制造集成电路的抗蚀剂。
  • PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME
    申请人:Kansai Research Institute (KRI)
    公开号:EP0962825A1
    公开(公告)日:1999-12-08
    A photosensitive resin composition comprises a base resin (e.g., novolak resins, polyvinylphenol-series polymers), a first photoactive ingredient (e.g., diazobenzoquinone derivatives, diazonaphthoquinone derivatives) and a second photoactive ingredient (e.g., mixtures with azide compounds) each having an absorption range at wavelength λ1 or λ2, the wavelengths thereof being different from each other. Between the first and second photoactive ingredients, at least one photoactive ingredient is substantially inert at the absorption wavelength of the other. After exposing the photosensitive resin composition to a light to form a pattern, the whole surface of the photosensitive layer is exposed to a light of the other wavelength to make the surface hardly soluble (in the case a positive pattern is formed) or readily soluble (in the case a negative pattern is formed) in a developer, and developed, thereby forming a pattern of high resolution. Utilizing an existing exposure system, there can be obtained photosensitive resin compositions (especially, resists for semiconductor production) having improved sensitivity and resolution.
    光敏树脂组合物包括基体树脂(如酚醛树脂、聚乙烯基苯酚系列聚合物)、第一种光活性成分(如重氮苯醌衍生物、重氮萘醌衍生物)和第二种光活性成分(如与叠氮化合物的混合物),每种光活性成分在波长λ1或λ2处均有吸收范围,其波长互不相同。在第一种和第二种光活性成分之间,至少有一种光活性成分在另一种光活性成分的吸收波长处基本上是惰性的。将感光树脂组合物曝光形成图案后,将感光层的整个表面曝光在另一波长的光下,使其表面难溶于显影剂(在形成正图案的情况下)或易溶于显影剂(在形成负图案的情况下),然后进行显影,从而形成高分辨率的图案。利用现有的曝光系统,可以获得具有更高灵敏度和分辨率的光敏树脂组合物(特别是用于半导体生产的抗蚀剂)。
  • JPS6076739A
    申请人:——
    公开号:JPS6076739A
    公开(公告)日:1985-05-01
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