This invention relates to a highly corrosion-resistant, multi-layer coated steel sheet, and includes an undercoat film obtained by galvanization or zinc-alloy plating and a chromate coated film thereon, on which a resin-composition film is further applied, comprising an organic high-molecular weight resin having a glass transision temperature of 343.degree. to 423.degree. K. and soluble in organic solvent and hydrophobic silica. For the purpose of improvement of corrosion preventiveness, a sparingly water soluble Cr compound may be contained in this resin composition film. Together with this sparingly water soluble Cr compound, a di- or tri-alkoxysilane compound may be also contained in the resin composition film.
PHOTOREACTIVE AGENT FOR REMOVING HARMFUL MATERIALS
申请人:——
公开号:US20020006425A1
公开(公告)日:2002-01-17
The present invention provides a photoreactive agent for removing harmful materials which comprises a substrate and a layer containing a photoreactive semiconductor and organic fine particles coated with inorganic fine particles which is formed on at least one side of the substrate; a photoreactive agent for removing harmful materials which comprises a substrate, a layer containing a photoreactive semiconductor and a layer containing organic fine particles coated with inorganic fine particles which layers are formed in that order on at least one side of the substrate; a photoreactive agent for removing harmful materials which comprises a substrate, a layer containing a photoreactive semiconductor and a layer containing film-forming inorganic fine particles and a water repellent which layers are formed in that order on at least one side of the substrate; and a photoreactive agent for removing harmful materials which comprises a substrate, a layer containing a photoreactive semiconductor, a layer containing film-forming inorganic fine particles and a layer containing a water repellent which layers are formed in that order on at least one side of the substrate. Said photoreactive agents for removing harmful materials are excellent in ability to remove harmful materials such as malodor, are water-resistant, are not changed in characteristics over a long period of time, and can easily be produced.
A photocurable resin composition suitable for use in three-dimensional photofabrication comprising (A) a cationically polymerizable organic compound, (B) a cationic photoinitiator, and (C) a (co)polymer obtainable by (co)polymerization of monomers comprising at least one (meth)acrylate-group comprising monomer.
A process for producing a three-dimensional object which comprises the use of a washing agent having a Hansen-solubility between 27-35 (Mpa)
1/2
.
A photocurable resin composition suitable for use in three-dimensional photofabrication comprising (A) a cationically polymerizable organic compound, (B) a cationic photoinitiator, and (C) a (co)polymer obtainable by (co)polymerization of monomers comprising at least one (meth)acrylate-group comprising monomer.
A process for producing a three-dimensional object which comprises the use of a washing agent having a Hansen-solubility between 27-35 (Mpa)
½
.
Resin composition for direct vapor deposition, molded articles made by using the same, and surface-metallized lamp housing
申请人:——
公开号:US20040249069A1
公开(公告)日:2004-12-09
The direct vapor depositing resin composition of the present invention comprises at least one selected from the group consisting of (A-I): a graft copolymer obtained by graft-polymerizing one or more monomers or a monomer mixture to a complex rubber-like polymer (G) composed of a polyorganosiloxane and a (meth)acrylate-based polymer and (A-II): a graft copolymer obtained by graft-polymerizing one or more monomers or a monomer mixture including an alkyl(meth)acrylate as an essential component to a rubber-like polymer (R) in which the content of diene units is 30% by weight or less in 100% by weight of the whole rubber-like polymer. The direct vapor depositing resin composition of the present invention can provide a beautiful bright appearance after direct vapor deposition of a metal, further, has high level mechanical strengths such as impact strength and the like, and weather resistance, and is also excellent in hot plate welding property with a transparent resin such as PMMA resins, PC resins and the like.