The present invention is related to a composition comprising an oxidizing compound and a complexing compound with the chemical formula wherein R1, R2, R3 and R4 are selected from the group consisting of H and any organic side chain. The oxidizing compound can be in the form of an aqueous solution. The complexing compound is for complexing metal ions. Metal ions can be present in the solution or in an external medium being contacted with the solution. The present invention can be used for cleaning a semiconductor substrate.
本发明涉及一种由氧化化合物和络合化合物组成的组合物,其
化学式为 R1、R2、R3 和 R4 选自 H 和任何有机侧链组成的组。氧化性化合物可以是
水溶液形式。络合化合物用于络合
金属离子。
金属离子可以存在于溶液中,也可以存在于与溶液接触的外部介质中。本发明可用于清洗半导体衬底。