Comprehensive Experimental Study of N-Heterocyclic π-Stacking Interactions of Neutral and Cationic Pyridines
摘要:
A comprehensive experimental study was carried out by measuring the relative strengths of parallel pi-stacking interactions of N-heterocycles with nonheterocycles. A versatile and rigid model system was developed, which was in equilibrium between a "closed" conformation that forms an intramolecular pi-stacking interaction and an "open" conformation that cannot form the interaction. First, the formation and geometries of the intramolecular N-heterocyclic pi-stacking interactions were verified by X-ray crystallography. Next, the closed/open ratios were measured in solution via integration of the H-1 NMR spectra, providing an accurate comparison of the N-heterocyclic pi-stacking interactions. The synthetic versatility of this model system enabled the systematic and comprehensive comparison of the influences of position, charge, and substituent effects of the nitrogen atom of the N-heterocycles within a single model system. The pi-stacking interactions of the neutral N-heterocyclic rings were slightly stronger than that of nonheterocyclic rings. Cationic N-heterocycles formed significantly stronger pi-stacking interactions than neutral N-heterocycles. The position of the nitrogen atom also had a strong influence on the stability of N-heterocyclic pi-stacking complexes. Interestingly, opposite stability trends were observed for neutral and cationic N-heterocycles. For neural N-heterocycles, geometries with the nitrogen away from the pi-face of the opposing ring were the more stable. For cationic N-heterocycles, geometries with the nitrogen close to the pi-face of the opposing ring were the more stable. Finally, N-methylated heterocycles consistently formed stronger pi-stacking interactions than N-protonated heterocycles.
Tipping the Balance between S-π and O-π Interactions
作者:Jungwun Hwang、Ping Li、Mark D. Smith、Constance E. Warden、Dominic A. Sirianni、Erik C. Vik、Josef M. Maier、Christopher J. Yehl、C. David Sherrill、Ken D. Shimizu
DOI:10.1021/jacs.8b07617
日期:2018.10.17
comprehensive experimental survey consisting of 36 molecular balances was conducted to compare 18 pairs of S-π versus O-π interactions over a wide range of structural, geometric, and solvent parameters. A strong linear correlation was observed between the folding energies of the sulfur and oxygen balances across the entire library of balance pairs. The more stable interaction systematically switched
Mono-functional monomers and methods for use thereof
申请人:Dershem Stephen M.
公开号:US20070155869A1
公开(公告)日:2007-07-05
The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.
The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.
A heat resistant copolymer composition is provided by blending two kinds of copolymers one of which is obtainable by polymerizing a maleimide monomer (A), an aromatic vinyl monomer (B), and unsaturated nitrile monomer (C) and optionally at least one other comonomer copolymerizable therewith (D) in a specific monomer ratio in the presence or absence of an elastomeric polymer and which has an intrinsic viscosity of 0.3 to 1.2 dl/g, and another of which is obtainable by copolymerizing the aromatic vinyl monomer (B), the unsaturated nitrile (C) and optionally at least one other comonomer copolymerizable therewith (D) in a specific monomer ratio in the presence or absence of the elastomeric polymer and which has an intrinsic viscosity of 0.3 to 1.5 dl/g.
The present invention relates to resin compositions adapted for weather, heat and light resistance, and which are also resistant to discolouration, comprising at least one polymeric substance and:
(A) a hindered amine stabiliser;
(B) a hindered-phenol-hindered amine stabiliser; and
(C) a UV absorber,
in amounts sufficient to confer resistance to discolouration on the composition.