Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
申请人:BREWER SCIENCE, INC.
公开号:US20030054117A1
公开(公告)日:2003-03-20
An improved method for applying polymeric antireflective coatings to substrate surfaces and the resulting precursor structures are provided. Broadly, the methods comprise plasma enhanced chemical vapor depositing (PECVD) a polymer on the substrate surfaces. The most preferred starting monomers are 4-fluorostyrene, 2,3,4,5,6-pentafluorostyrene, and allylpentafluorobenzene. The PECVD processes comprise subjecting the monomers to sufficient electric current and pressure so as to cause the monomers to sublime to form a vapor which is then changed to the plasma state by application of an electric current. The vaporized monomers are subsequently polymerized onto a substrate surface in a deposition chamber. The inventive methods are useful for providing highly conformal antireflective coatings on large surface substrates having super submicron (0.25 &mgr;m or smaller) features. The process provides a much faster deposition rate than conventional chemical vapor deposition (CVD) methods, is environmentally friendly, and is economical.
本发明提供了一种改进的方法,可将聚合物抗反射涂层应用于基底表面及由此产生的前驱体结构。概括地说,该方法包括在基底表面进行等离子体增强化学气相沉积(PECVD)聚合物。最优选的起始单体是 4-氟苯乙烯、2,3,4,5,6-五氟苯乙烯和烯丙基五氟苯。PECVD 工艺包括将单体置于足够的电流和压力下,使单体升华形成蒸汽,然后通过施加电流将蒸汽转变为等离子状态。气化的单体随后在沉积室中聚合到基底表面上。本发明的方法适用于在具有超亚微米(0.25 微米或更小)特征的大表面基底上提供高保形防反射涂层。与传统的化学气相沉积(CVD)方法相比,该工艺的沉积速率快得多,而且环保、经济。