There is provided a (meth)acrylic resin composition containing a (meth)acrylic resin, and a compound denoted by General Formula (1) described below, a film formed by using the (meth)acrylic resin composition, and a polarizing plate and a liquid crystal display device including the film:
wherein R
1
to R
8
each independently represent a hydrogen atom, a halogen atom, a hydroxyl group, or a hydrocarbon group having 1 to 12 carbon atoms, X represents a divalent alicyclic group having 4 to 20 carbon atoms, the alicyclic group represented by X may have at least one substituent group selected from a halogen atom, an aliphatic hydrocarbon group having 1 to 12 carbon atoms, and an aromatic hydrocarbon group having 6 to 15 carbon atoms.
Indane bisphenols, polymers derived therefrom, and methods of use thereof
申请人:SABIC Global Technologies B.V.
公开号:US09102598B2
公开(公告)日:2015-08-11
Indane bisphenol monomer units, and polymers derived from such monomer units are provided. Blends including such polymers, articles made from such polymers and blends, methods of using such monomers, polymers, and blends, and processes for preparing such monomers, polymers, and blends are also provided.
Thermoplastic polymer composition having thermosetting processing characteristics
申请人:SHELL INTERNATIONALE RESEARCH
MAATSCHAPPIJ B.V.
公开号:EP0249263A2
公开(公告)日:1987-12-16
The present invention relates to a new thermoplastic polymer composition having the processing characteristics of a thermosetting polymer along with an improved balance of properties including improved modulus/glass transition temperature/toughness balance. These new polymer compositions are prepared by reacting certain amine compounds with certain diepoxide compounds to form linear units which are lightly crosslinked. Also disclosed and claimed are processes for preparing such compositions, cured compositions and end-use applications.
Provided are: a curable composition from which a cured article having excellent molding processability and high heat resistance as well as such a high Tg that it can be used as a molding resin for a SiC power semiconductor can be obtained; and a cured article thereof. The curable composition comprises: 100 parts by mass of a compound having at least two partial structures represented by the following Formula (1) in the molecule as a component (A); 0.5 to 3 parts by mass of a thermal radical generator as a component (B); and 0 to 50 parts by mass of other radical-reactive compound as a component (C):
(wherein, ring A represents a benzene ring or a cyclohexyl ring; R1 represents an alkylene group having 1 to 6 carbon atoms; R2 represents an alkyl group having 1 to 4 carbon atoms; a represents a number of 0 or 1; b represents an integer of 0 to 3; and c represents a number of 1 or 2).