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1-benzylpyrazinium bromide | 163800-97-3

中文名称
——
中文别名
——
英文名称
1-benzylpyrazinium bromide
英文别名
1-Benzyl-pyrazin-1-ium; bromide;1-Benzyl-1-pyrazinium Bromide;1-benzylpyrazin-1-ium;bromide
1-benzylpyrazinium bromide化学式
CAS
163800-97-3
化学式
Br*C11H11N2
mdl
——
分子量
251.126
InChiKey
YVAGLNLCWGCFDS-UHFFFAOYSA-M
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    -1.58
  • 重原子数:
    14
  • 可旋转键数:
    2
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.09
  • 拓扑面积:
    16.8
  • 氢给体数:
    0
  • 氢受体数:
    2

反应信息

  • 作为反应物:
    描述:
    参考文献:
    名称:
    NUVOLE, A.;PAGLIETTI, G.;SANNA, P.;ACHESON, R. M., J. CHEM. RES. MICROFICHE, 1984, N 11, 356-357
    摘要:
    DOI:
  • 作为产物:
    描述:
    吡嗪溴甲苯丙酮 为溶剂, 以75 %的产率得到1-benzylpyrazinium bromide
    参考文献:
    名称:
    N-烷基吡啶鎓盐与咪唑并[1,2-a]吡啶的铜催化氧化[3 + 2]环加成反应
    摘要:
    开发了在亚磷酸二乙酯存在下吡啶鎓盐和三甲基硅烷基氰化物 (TMSCN) 的铜催化反应。该反应首次实现了从容易获得的起始材料一步构建生物学上重要的2-氰基咪唑并[1,2- a ]吡啶的反应,并且在克级是可行的。该协议的范围通过 27 个示例进行了演示。在这一一锅法中可以实现连续的双氰化和环化。TMSCN 发挥双重作用,不仅作为“CN”源,而且作为咪唑并[1,2- a ]吡啶环化的偶联伙伴。
    DOI:
    10.1021/acs.joc.3c00728
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文献信息

  • Epoxy Resin Curing System Containing Latent Catalytic Curing Agent Causing The Expansion Of Volume
    申请人:——
    公开号:US20030073801A1
    公开(公告)日:2003-04-17
    The present invention relates to a novel epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, characterized by exhibiting no shrinkage of volume or inducing an expansion of volume during the curing reaction of the epoxy resin. By the use of the epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, it is possible to inhibit the shrinkage of volume or to induce the expansion of volume during the curing reaction of the epoxy resin. The development of such curing systems made it possible to improve the dimensional stability and to remove the residual stress, which has caused problems for decades in the production of various molded articles. Furthermore, the curing systems according to the present invention have excellent adhesive properties, thereby making it possible to develop adhesives for accurate spatial infiltration.
    本发明涉及一种新型环氧树脂固化系统,包括一种阳离子潜在催化剂固化剂,其中含有六酸盐,其特征在于在环氧树脂的固化反应过程中不会出现体积收缩或体积膨胀。 通过使用包含六酸盐的阳离子潜在催化剂固化剂的环氧树脂固化系统,可以抑制环氧树脂固化反应过程中的体积收缩或体积膨胀。这种固化系统的开发使得能够改善尺寸稳定性并消除残余应力,在生产各种成型品的过程中已经存在了数十年的问题。此外,本发明的固化系统具有良好的粘附性能,因此可以开发用于精确空间渗透的粘合剂。
  • Epoxy resin curing system containing latent catalytic curing agent causing the expansion of volume
    申请人:Lee Jae-Rock
    公开号:US06977274B2
    公开(公告)日:2005-12-20
    The present invention relates to a novel epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, characterized by exhibiting no shrinkage of volume or inducing an expansion of volume during the curing reaction of the epoxy resin. By the use of the epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, it is possible to inhibit the shrinkage of volume or to induce the expansion of volume during the curing reaction of the epoxy resin. The development of such curing systems made it possible to improve the dimensional stability and to remove the residual stress, which has caused problems for decades in the production of various molded articles. Furthermore, the curing systems according to the present invention have excellent adhesive properties, thereby making it possible to develop adhesives for accurate spatial infiltration.
    本发明涉及一种新型环氧树脂固化体系,包括一种含有六的阳离子潜在催化固化剂,其特点是在环氧树脂固化反应过程中不会出现体积收缩或体积膨胀。通过使用包含六的阳离子潜在催化固化剂的环氧树脂固化体系,可以抑制环氧树脂固化反应过程中的体积收缩或诱导体积膨胀。这种固化体系的开发使得可以提高尺寸稳定性并消除残余应力,这些问题在生产各种模塑制品方面已经存在了几十年。此外,本发明的固化体系具有优异的粘接性能,从而可以开发用于精确空间渗透的粘合剂。
  • Benzylpyrazinium Salts as Thermally Latent Initiators in the Polymerization of Glycidyl Phenyl Ether:  Substituent Effect on the Initiator Activity and Mechanistic Aspects
    作者:Moon Suk Kim、Kyu Wan Lee、Takeshi Endo、Sang Bong Lee
    DOI:10.1021/ma0496596
    日期:2004.7.1
  • US6977274B2
    申请人:——
    公开号:US6977274B2
    公开(公告)日:2005-12-20
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