Photosensitive resin composition and photosensitive films and laminates made by using the same
申请人:——
公开号:US20040265731A1
公开(公告)日:2004-12-30
A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.
本发明的光敏树脂组合物包含(A)可溶性聚酰亚胺和(b)(甲基)丙烯酸化合物,其中(A)可溶性聚酰亚胺可在有机溶剂中溶解,并通过使用酸性二酐组分和至少一种含有硅氧烷结构或芳香环结构的二胺组分以及结构中具有羟基、羧基或羰基的二胺组分合成,(B)(甲基)丙烯酸化合物具有至少一个碳-碳双键,并且最好包含至少一个(C)光反应引发剂和(D)阻燃剂。通过这种安排,本发明的光敏树脂组合物具有优异的性能。特别是,本发明的光敏树脂组合物非常有用,可以用于电子零件等。