2,3,4-trimethyl-pentenedioic acid-anhydride | 117726-53-1

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 吡喃
• 英文名称: 2,3,4-trimethyl-pentenedioic acid-anhydride
• 英文别名: 2,3,4-Trimethyl-pentendisaeure-anhydrid；3,4,5-trimethyl-3H-pyran-2,6-dione
• CAS: 117726-53-1
• 化学式: C₈H₁₀O₃
• 分子量: 154.166
• InChiKey: XSEKLIDLTOGLTM-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1
• 重原子数：
  11
• 可旋转键数：
  0
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.5
• 拓扑面积：
  43.4
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  重氮甲烷 、 2,3,4-trimethyl-pentenedioic acid-anhydride 生成 6-Methoxy-3,4,5-trimethylpyran-2-one
  参考文献：
  名称：

  Synthesis of substituted benzenoids and biphenyls via diels-aldercycloaddition of 6-methoxy-2-pyrones

  摘要：

  DOI：

  10.1016/s0040-4039(00)80362-7
• 作为产物：
  描述：

  (+/-)-trans-2,3,4-Trimethyl-2-pentendicarbonsaeure 在 乙酰氯 作用下， 生成 2,3,4-trimethyl-pentenedioic acid-anhydride
  参考文献：
  名称：

  Thole; Thorpe, Journal of the Chemical Society, 1911, vol. 99, p. 2205

  摘要：

  DOI：

文献信息

• Rogerson; Thorpe, Journal of the Chemical Society, 1905, vol. 87, p. 1692
  作者：Rogerson、Thorpe

  DOI：——

  日期：——
• AHMED, SALMAN A.;BARDSHIRI, ESFANDIAR;SIMPSON, THOMAS J., TETRAHEDRON LETT., 29,(1988) N 13, 1595-1596
  作者：AHMED, SALMAN A.、BARDSHIRI, ESFANDIAR、SIMPSON, THOMAS J.

  DOI：——

  日期：——
• REACTION PRODUCTS BASED ON AMPHIPHILIC BLOCK COPOLYMERS AND THEIR USE AS IMPACT MODIFIER
  申请人：Kramer Andreas

  公开号：US20110114257A1

  公开（公告）日：2011-05-19

  Novel impact modifiers obtained by the reaction of amphiphilic block copolymers. These impact modifiers are suitable for use in thermosetting epoxy resin adhesives. The impact modifiers include a carboxylic acid group prepared from the reaction of an intramolecular anhydride of a di- or tricarboxylic acid with at least one amphiphilic block copolymer including at least one hydroxyl group. A method for adhesively binding heat-stable substrates includes applying a single-component thermosetting epoxy resin composition to the surface of a first heat-stable substrate; contacting the epoxy resin composition with the surface of second heat-stable substrate; heating the epoxy resin composition to 20-100° C.; bringing the two substrates and the epoxy resin composition into contact with a wash liquid; and heating the epoxy resin composition to 140-220° C.