diperoxyadipic acid di-tert-butyl ester | 22158-52-7

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: diperoxyadipic acid di-tert-butyl ester
• 英文别名: Diperoxyadipinsaeure-di-tert-butylester；di-t-butyl diperoxyadipate；Di-tert.-butyl-diperoxyadipat；Di-tert.-butyl-peradipat；Di(tert-butyl) hexanediperoxoate；ditert-butyl hexanediperoxoate
• CAS: 22158-52-7
• 化学式: C₁₄H₂₆O₆
• 分子量: 290.357
• InChiKey: YFQXEEXTCUCORR-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.6
• 重原子数：
  20
• 可旋转键数：
  11
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  71.1
• 氢给体数：
  0
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  叔丁基过氧化氢 、 己二酰氯 在 氢氧化钾 作用下， 生成 diperoxyadipic acid di-tert-butyl ester
  参考文献：
  名称：

  有机过氧化物的研究；叔丁基过酸酯。

  摘要：

  DOI：

  10.1021/ja01208a033

文献信息

• Cyanate ester based thermoset compositions
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP0945477A1

  公开（公告）日：1999-09-29

  Curable compositions used in circuit boards, structural composite, encapsulating resins, and the like, comprise at least one of a cyanate ester and a cyanate ester prepolymer, a cyanate ester-free aryloxytriazine, and a curing catalyst.

  用于电路板、结构复合材料、封装树脂等的可固化组合物包括氰酸酯和氰酸酯预聚物、不含氰酸酯的芳氧基三嗪和固化催化剂中的至少一种。
• Poly(arylene ether) adhesive compositions
  申请人：GENERAL ELECTRIC COMPANY

  公开号：EP1167484A2

  公开（公告）日：2002-01-02

  An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications.

  一种用于热塑性薄膜的粘合剂是由聚芳基醚、热固性树脂、增韧剂、可选增塑剂和固化剂的混合物组成。这种粘合剂在电路板应用中特别有用。
• Moldable poly(arylene ether) thermosetting compositions, methods, and articles
  申请人：——

  公开号：US20030018131A1

  公开（公告）日：2003-01-23

  A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an easily dissolved solid concentrate with the thermosetting resin.

  一种可模塑的热固性组合物由聚芳基醚、热固性树脂、增韧剂和胺固化剂组成。这种组合物无需溶剂即可方便地制备，聚（芳基烯）醚可以与热固性树脂一起以易于溶解的固体浓缩物的形式提供。
• Modified polyphenylene ether
  申请人：——

  公开号：US20030045757A1

  公开（公告）日：2003-03-06

  Disclosed is a modified polyphenylene ether having a number average molecular weight of not smaller than 4,000, which is obtained by reacting a precursory modified polyphenylene ether with a phenolic compound in the presence of a radical generator, wherein the precursory modified polyphenylene ether comprises a plurality of polyphenylene ether chains each having a terminal phenolic hydroxyl group, wherein the plurality of polyphenylene ether chains collectively have at least one terminal phenolic hydroxyl group modified and wherein not all of the terminal phenolic hydroxyl groups of the plurality of polyphenylene ether chains are modified. Also disclosed is a method for producing the modified polyphenylene ether.

  本发明公开了一种平均分子量不小于 4000 的改性聚苯醚，该改性聚苯醚是由前体改性聚苯醚与酚类化合物在自由基发生器存在下反应而得、其中前体改性聚苯醚包括多个聚苯醚链，每个聚苯醚链具有一个末端酚羟基，多个聚苯醚链中至少有一个末端酚羟基被改性，且多个聚苯醚链中并非所有的末端酚羟基都被改性。还公开了一种生产改性聚苯醚的方法。
• Powder coating compositions
  申请人：——

  公开号：US20030236361A1

  公开（公告）日：2003-12-25

  Powder coating compositions comprising at least one thermosetting resin and at least one poly(phenylene ether) are disclosed. The compositions have excellent fracture toughness and thermal properties.

  本发明公开了包含至少一种热固性树脂和至少一种聚亚苯基醚的粉末涂料组合物。该组合物具有优异的断裂韧性和热性能。