acrylic acid-(2-dimethylamino-propyl ester) | 99969-68-3

• 分子结构分类: 有机化合物 - 有机酸及其衍生物 - 羧酸及其衍生物
• 英文名称: acrylic acid-(2-dimethylamino-propyl ester)
• 英文别名: Acrylsaeure-(2-dimethylamino-propylester)；1-Acryloyloxy-2-dimethylamino-propan；2-dimethylaminopropyl acrylate；2-(Dimethylamino)propyl prop-2-enoate
• CAS: 99969-68-3
• 化学式: C₈H₁₅NO₂
• 分子量: 157.213
• InChiKey: NMBXBBSVGZNJCE-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.1
• 重原子数：
  11
• 可旋转键数：
  5
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.62
• 拓扑面积：
  29.5
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  acrylic acid-(2-dimethylamino-propyl ester) 生成 3-trimethylammonio-propionic acid-(2-trimethylammonio-propylester); diiodide
  参考文献：
  名称：

  Hypotensors. 2-Ammonioalkyl 3-Ammonioalkanoate Salts¹

  摘要：

  DOI：

  10.1021/ja01523a036
• 作为产物：
  描述：

  2-(二甲基氨基)-1-丙醇 、 丙烯酰氯 在 苯 作用下， 生成 acrylic acid-(2-dimethylamino-propyl ester)
  参考文献：
  名称：

  Hypotensors. 2-Ammonioalkyl 3-Ammonioalkanoate Salts¹

  摘要：

  DOI：

  10.1021/ja01523a036

文献信息

• PEPTIDES FOR BINDING ALTERNATIVELY ACTIVATED MACROPHAGES
  申请人：University of Washington

  公开号：US20170246311A1

  公开（公告）日：2017-08-31

  M2 macrophage-binding peptides and polymers and related methods of use are described.

  本文描述了M2巨噬细胞结合肽和聚合物以及相关的使用方法。
• Polyacryamide beads containing encapsulated cells
  申请人：Zigova Jana

  公开号：US20050089987A1

  公开（公告）日：2005-04-28

  Polyacrylamide beads containing encapsulated cells were prepared by a process comprising the steps of (i) providing an aqueous solution of a mixture of acrylic monomers, (ii) providing a suspension of cells in an aqueous solution of a persulfate (iii) providing an emulsion of an aqueous solution of a tertiary amine in a water-immiscible liquid, which liquid optionally contains a surfactant, (iv) mixing the solution provided in step (i) and the suspension provided in step (ii) (v) adding the mixture obtained in step (iv) to the stirred emulsion provided in step (iii) (vi) polymerizing the mixture of acrylic monomers and simultaneously encapsulating the cells to form polyacrylamide beads containing encapsulated cells.

  聚丙烯酰胺珠子中含有封装细胞，制备过程包括以下步骤：（i）提供丙烯酸单体混合物的水溶液，（ii）在过硫酸盐的水溶液中提供细胞的悬浮液，（iii）在不溶于水的液体中提供三级胺的水溶液的乳液，该液体可选地含有表面活性剂，（iv）混合步骤（i）提供的溶液和步骤（ii）提供的悬浮液，（v）将步骤（iv）获得的混合物加入步骤（iii）提供的搅拌乳液中，（vi）聚合丙烯酸单体混合物并同时封装细胞以形成含有封装细胞的聚丙烯酰胺珠子。
• PHARMACEUTICAL OR NEUTRACEUTICAL FORMULATION
  申请人：Lizio Rosario

  公开号：US20120315334A1

  公开（公告）日：2012-12-13

  The invention relates to a pharmaceutical or nutraceutical formulation comprising a core, comprising an active pharmaceutical or nutraceutical ingredient, a penetration promoter and a bioavailability promoting agent, and a polymeric coating for the gastrointestinal targeted release of the active ingredient, characterized in that the bioavailability promoting agent is a pharmaceutically acceptable inhibitor of proteolytic enzymes, which increases the oral bioavailability of the active ingredient by a factor of at least five, compared to a corresponding formulation without the bioavailability promoting agent.

  本发明涉及一种制药或营养药物组合物，包括一个核心，包括一个活性药物或营养成分、一个渗透促进剂和一个生物利用度促进剂，并且包括一个聚合物涂层，用于胃肠定向释放活性成分，其特征在于生物利用度促进剂是一种药学上可接受的蛋白酶酶抑制剂，通过与没有生物利用度促进剂的相应组合物相比，可以将口服活性成分的生物利用度增加至少五倍。
• Method of making patterns
  申请人：CIBA-GEIGY AG

  公开号：EP0326516A2

  公开（公告）日：1989-08-02

  A method of making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas comprises (i) protecting the bare metal by electrodepositing thereon a heat-curable polymeric film having (a) a group which is reactive with an isocyanate group and (b) a blocked isocyanate group, (ii) heating the electrodeposited polymeric film to render it resistant to a solvent with which the resist is removable, (iii) removing the resist from said remaining areas using a solvent which does not remove the electrodeposited polymeric film, thereby exposing metal in said remaining areas, and (iv) etching the metal exposed in step (iii) using an etchant which does not remove the electrodeposited polymeric film, thereby leaving a metallic pattern protected by the electrodeposited polymeric film, which can be removed subsequently using a solvent therefor. The method is useful in the production of printed circuits.

  一种在基底上制作金属图案的方法，该基底的表面包括预定区域的裸金属和剩余区域的抗蚀剂涂层金属，该方法包括 (i) 在裸金属上电沉积一层热固化聚合膜以保护裸金属，该聚合膜具有 (a) 与异氰酸酯基团反应的基团和 (b) 被阻断的异氰酸酯基团、 (ii) 加热电沉积的聚合物薄膜，使其能够耐受可去除抗蚀剂的溶剂、 (iii) 使用不去除电沉积聚合物薄膜的溶剂去除所述剩余区域的抗蚀剂，从而在所述剩余区域暴露金属，以及 (iv) 使用不去除电沉积聚合物薄膜的蚀刻剂蚀刻步骤(iii)中暴露的金属，从而留下受电沉积聚合物薄膜保护的金属图案，随后可使用溶剂将其去除。 该方法适用于印刷电路的生产。
• A method of making a metallic pattern on a substrate
  申请人：CIBA-GEIGY AG

  公开号：EP0402315A2

  公开（公告）日：1990-12-12

  A method of making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas comprises (i) protecting the bare metal by electrodepositing thereon a film of an organic resin, (ii) immersing the substrate bearing the electrodeposited resin film in an aqueous solution or dispersion of a hardening agent for said film, said hardening agent being a material which is curable, either alone or through reaction with functional groups in the electrodeposited resin film, on heating or irradiation, whereby said aqueous solution or dispersion dif fuses into the surface of the electrodeposited resin film, (iii) subjecting the substrate to curing conditions for the hardening agent, thereby hardening the surface of the electro­deposited film and rendering it resistant to a solvent used to remove the resist and resistant to an etchant used to remove metal from areas exposed by removal of the resist, (iv) removing the resist from said remaining areas using a solvent which does not remove the electrodeposited resin film, and (v) etching metal exposed in step (iv) using an etchant which does not remove the electrodeposited resin film.

  一种在基底上制作金属图案的方法，该基底的表面包括预定区域的裸金属和剩余区域的抗蚀剂涂层金属，该方法包括 (i) 在裸金属上电沉积一层有机树脂薄膜，以保护裸金属、 (ii) 将承载电沉积树脂薄膜的基底浸入上述薄膜的固化剂水溶液或分散液中，所述固化剂是一种在加热或辐照时可单独固化或通过与电沉积树脂薄膜中的官能团反应固化的材料，从而使上述水溶液或分散液与电沉积树脂薄膜的表面融合、 (iii) 将基底置于固化剂的固化条件下，从而硬化电沉积薄膜的表面，使其能够耐受用于去除抗蚀剂的溶剂，并耐受用于去除抗蚀剂暴露区域金属的蚀刻剂、 (iv) 使用不去除电沉积树脂薄膜的溶剂去除所述剩余区域的抗蚀剂，以及 (v) 使用不去除电沉积树脂薄膜的蚀刻剂蚀刻步骤 (iv) 中暴露的金属。