There are here disclosed a photoresist material for lithography using a light of 220 nm or less which comprises at least a polymer represented by the following formula (2) and a photo-acid generator for generating an acid by exposure:
wherein R
1
, R
2
, R
3
and R
5
are each a hydrogen atom or a methyl group; R
4
is an acid-labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has an acid labile group, an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group, or a hydrocarbon group having 3 to 13 carbon atoms, which has an epoxy group; R
6
is a hydrogen atom, a hydrocarbon group having 1 to 12 carbon atoms, or an alicyclic hydrocarbon group having 7 to 13 carbon atoms, which has a carboxyl group; x, y and z are optional values which meet x+y+z=1, 0
本文披露了一种光刻用220纳米或以下光的光阻材料,包括至少一种由以下式子(2)表示的聚合物和用于曝光生成酸的光酸发生剂:
其中,R1、R2、R3和R5分别是氢原子或甲基基团;R4是酸敏感基团、具有7至13个碳原子的脂环烃基团、具有酸敏感基团的7至13个碳原子的脂环烃基团、具有3至13个碳原子的环烃基团、具有环氧基团;R6是氢原子、具有1至12个碳原子的碳氢基团或具有7至13个碳原子的脂环烃基团,具有羧基;x、y和z是可选值,满足x+y+z=1,0
PATTERNABLE LOW DIELECTRIC CONSTANT MATERIALS AND THEIR USE IN ULSI INTERCONNECTION
申请人:Lin Qinghuang
公开号:US20080063880A1
公开(公告)日:2008-03-13
The present invention relates to ultra-large scale integrated (ULSI) interconnect structures, and more particularly to patternable low dielectric constant (low-k) materials suitable for use in ULSI interconnect structures. The patternable low-k dielectrics disclosed herein are functionalized polymers that having one or more acid-sensitive imageable functional groups.
本发明涉及超大规模集成(ULSI)互连结构,更具体地涉及适用于ULSI互连结构的可图案化低介电常数(低-k)材料。本发明所披露的可图案化低-k介电材料是具有一种或多种酸敏感可成像功能基团的功能化聚合物。
Cyclohexene Oxide Compound Having Cyclohexyl Group or Long-Chain Alkyl Group, and Use Thereof
申请人:Kato Hisao
公开号:US20080108725A1
公开(公告)日:2008-05-08
An object of the present invention is to provide a cyclohexene oxide compound that gives a cured resin having a low refractive index and excellent transparency, curability, mold release properties, and mechanical properties, and that can be used as a component of an actinic radiation curing composition and/or heat curing composition.
The present invention is a cyclohexene oxide compound having a cyclohexyl group or a long-chain alkyl group, represented by Formula (1) below
(in Formula (1), A denotes a cyclohexyl group, Formula (2) below, or an optionally branched alkyl group having 8 to 16 carbons)
(in Formula (2), R
1
denotes a hydrogen atom or an optionally branched alkyl group having 1 to 4 carbons and R
2
denotes a hydrogen atom or an optionally branched alkyl group having 1 to 4 carbons).
本发明的目的是提供一种环己烯氧化物化合物,该化合物能够产生具有低折射率和优异透明度、可固化性、模具脱模性和机械性能的固化树脂,并可用作光敏辐射固化组合物和/或热固化组合物的组分。本发明是一种具有环己基或长链烷基的环己烯氧化物化合物,由下式(1)表示(在式(1)中,A表示环己基、下式(2)或具有8至16个碳的可选支链烷基)(在式(2)中,R1表示氢原子或具有1至4个碳的可选支链烷基,R2表示氢原子或具有1至4个碳的可选支链烷基)。
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