2,2a(2)-[1,7-Heptanediylbis(oxymethylene)]bis[oxirane] | 373609-57-5

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 环氧化物
• 英文名称: 2,2a(2)-[1,7-Heptanediylbis(oxymethylene)]bis[oxirane]
• 英文别名: 2-[7-(oxiran-2-ylmethoxy)heptoxymethyl]oxirane
• CAS: 373609-57-5
• 化学式: C₁₃H₂₄O₄
• 分子量: 244.33
• InChiKey: LSVJSOQIMZXASI-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.3
• 重原子数：
  17
• 可旋转键数：
  12
• 环数：
  2.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• ACTIVE-ENERGY-RAY-CURABLE SEALING AGENT COMPOSITION, AND MEMBER HAVING SEALING LAYER ATTACHED THERETO
  申请人：Huntsman Advanced Materials (Switzerland) GmbH

  公开号：EP2287269A1

  公开（公告）日：2011-02-23

  An photo-curable sealing agent composition comprising (A) an unsaturated group-containing urethane resin having a number average molecular weight of 1, 000-100, 000 and an unsaturation dgree of 0 .1-1 mol/kg, which is obtained by reaction of (a) a polycarbonate diol having a number average molecular weight of 500-3,000, (b) a bifunctional epoxy (meth)acrylate having two hydroxyl groups and two ethylenically unsaturated groups, and (c) a polyisocyanate; (B) a (meth)acrylic acid ester monomer, wherein an alcohol residue, ester-bonded with an (meth)acyloyl group, is a hydrocarbon group which may contain an oxygen atom, and has 1-20 carbon atoms and a molecular weight of not larger than 1,000; and (C) a photopolymerization initiator. The sealing agent composition exhibits a high curability performance and gives a cured product having a low hardness and enhanced flexibility and elongation, and improved physical and mechanical strength and enhanced durability.

  一种光固化密封剂组合物，包括 (A) 含不饱和基团的聚氨酯树脂，其平均分子量为 1 000-100 000，不饱和度为 0 .1-1摩尔/千克，它是由(a)平均分子量为500-3000的聚碳酸酯二元醇，(b)具有两个羟基和两个乙烯不饱和基团的双官能环氧(甲基)丙烯酸酯和(c)多异氰酸酯反应而得；(B) (甲基)丙烯酸酯单体，其中与(甲基)丙烯酰基酯键合的醇残基是可含有氧原子的烃基，具有 1-20 个碳原子，分子量不大于 1,000；以及 (C) 光聚合引发剂。密封剂组合物具有很高的固化性能，固化后的产品硬度低，柔韧性和伸长率增强，物理和机械强度提高，耐久性增强。
• EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL
  申请人：DIC Corporation

  公开号：EP2832759A1

  公开（公告）日：2015-02-04

  The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.

  本发明提供了一种具有低熔点、低熔融粘度、优异的溶剂溶解性和优异的加工性的环氧树脂。此外，本发明还提供了一种环氧树脂组合物及其固化产品，具有优异的流动性、加工性、柔韧性、粘附性和导热性。环氧树脂由以下通式（I）表示（Q：具有 C1-C9 直链部分的亚烷基链，其侧链中可能含有一个 C1-C18 烷基，或在亚烷基链中的两个连续亚甲基之间存在一个醚键的连接链；A：直接或通过连接链键合 2 至 4 个亚苯基的亚苯基单元，或萘基单元，n：0 至 10）。环氧树脂组合物包含环氧树脂和固化剂。组合物包括环氧树脂。
• LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3636688A1

  公开（公告）日：2020-04-15

  A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).

  一种用于压缩成型的液体树脂组合物含有脂肪族环氧化合物（A）、分子中含有芳香环的环氧化合物（B）、含氮杂环化合物（C）和无机填料（D）。
• EPOXY RESIN, EPOXY RESIN-CONTAINING COMPOSITION AND CURED PRODUCT OF SAME
  申请人：Mitsubishi Chemical Corporation

  公开号：EP3632951A1

  公开（公告）日：2020-04-08

  An object of the present invention is to provide an epoxy resin, an epoxy resin-containing composition, and a cured product which are excellent in flexibility. The present invention relates to an epoxy resin, which is a reaction product of an epoxy compound (A) and an acid-terminated polyester (B). In addition, the present invention relates to an epoxy resin-containing composition and a cured product obtained by using the epoxy resin.

  本发明的目的是提供一种柔韧性极佳的环氧树脂、含环氧树脂的组合物和固化产品。本发明涉及一种环氧树脂，它是环氧化合物（A）和酸端聚酯（B）的反应产物。此外，本发明还涉及一种含环氧树脂的组合物以及使用该环氧树脂得到的固化产品。
• EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, CURABLE RESIN COMPOSITION CONTAINING EPOXY GROUP-CONTAINING POLYORGANOSILOXANE, AND CURED PRODUCT OF SAME
  申请人：Mitsubishi Chemical Corporation

  公开号：EP3760660A1

  公开（公告）日：2021-01-06

  An object of the present invention is to provide an epoxy group-containing polyorganosiloxane, a curable resin composition and a cured product which are excellent in curability, surface nature of a coating film, adhesiveness, and impact resistance. The epoxy group-containing polyorganosiloxane of the present invention contains an M unit (R1R2R3SiO1/2), a D unit (R4R5O2/2), and a Q unit (SiO4/2), wherein a content of a T unit (R6SiO3/2) with respect to total silicon is 80 mol% or less. The curable resin composition of the present invention contains the epoxy group-containing polyorganosiloxane (A) and a curing agent (B).

  本发明的目的是提供一种含环氧基团的聚有机硅氧烷、一种可固化树脂组合物和一种固化产品，它们在固化性、涂膜表面性质、粘合性和抗冲击性方面都非常出色。本发明的含环氧基团的聚有机硅氧烷含有一个 M 单元（R1R2R3SiO1/2）、一个 D 单元（R4R5O2/2）和一个 Q 单元（SiO4/2），其中 T 单元（R6SiO3/2）的含量占总硅量的 80 摩尔%或更少。本发明的可固化树脂组合物包含含环氧基团的聚有机硅氧烷（A）和固化剂（B）。