EPOXY RESIN, METHOD FOR PRODUCING EPOXY RESIN, EPOXY RESIN COMPOSITION, CURED PRODUCT THEREOF, AND HEAT-DISSIPATING RESIN MATERIAL
申请人:DIC Corporation
公开号:EP2832759A1
公开(公告)日:2015-02-04
The present invention provides an epoxy resin having a low melting point, low melt viscosity, excellent solvent solubility, and excellent processability. Also, the present invention provides an epoxy resin composition and a cured product thereof having excellent fluidity, processability, flexibility, adhesion, and thermal conductivity. The epoxy resin is represented by general formula (I) below (Q: an alkylene chain having a C1-C9 linear part which may have a C1-C18 alkyl group in a side chain, or a linkage chain having an ether bond present between two continuous methylene groups in the alkylene chain; A: a phenylene unit in which 2 to 4 phenylene groups are bonded directly or through a linkage chain, or a naphthylene unit, n: 0 to 10). The epoxy resin composition contains the epoxy resin and a curing agent. The composition includes the epoxy resin.
本发明提供了一种具有低熔点、低熔融粘度、优异的溶剂溶解性和优异的加工性的环氧树脂。此外,本发明还提供了一种环氧树脂组合物及其固化产品,具有优异的流动性、加工性、柔韧性、粘附性和导热性。环氧树脂由以下通式(I)表示(Q:具有 C1-C9 直链部分的亚烷基链,其侧链中可能含有一个 C1-C18 烷基,或在亚烷基链中的两个连续亚甲基之间存在一个醚键的连接链;A:直接或通过连接链键合 2 至 4 个亚苯基的亚苯基单元,或萘基单元,n:0 至 10)。环氧树脂组合物包含环氧树脂和固化剂。组合物包括环氧树脂。