The present invention relates to a viscometric properties improver capable of improving the fuel efficiency of an internal combustion engine, and an additive composition for a liquid coolant containing the viscometric properties improver. [1] A viscometric properties improver consisting of a compound (A) represented by the following formula (1) and a compound (B) represented by the following formula (2), and [2] an additive composition for a liquid coolant containing the same:
R
1
OR
2
O
m
SO
3
M (1)
R
3
O—SO
3
M (2)
wherein R
1
and R
3
are the same as or different from each other and each represent a linear or branched alkyl group or alkenyl group having 12 or more and 24 or less carbon atoms; R
2
represents an ethylene group or a propylene group; m represents an addition molar number of R
2
O of 1 or more and 15 or less; and M represents a cation or a hydrogen atom.
Method for forming a metal film on the surface of a substrate metal
申请人:Harima Chemicals, Inc.
公开号:US05021269A1
公开(公告)日:1991-06-04
A method for forming a metal film on the surface of a substrate metal, which comprises soaking a substrate metal or a non-metal support carrying the substrate metal thereon in a solution of a metal salt in a high boiling point solvent under heating conditions, characterized in that the metal salt is a salt of the metal to be formed on the surface of the substrate metal with an acidic substance selected from an organic carboxylic acid, a rosin and a rosin derivative. The metal is precipitated from the solution exclusively on the surface of the substrate metal without forming any solid metal particle in the solution or on the substrate metal. Thus, the method is applicable to the formation of a soldering alloy as a film on the surface of a substrate metal without leaving thereon any free metal particle which may cause short circuits in electronic circuits. The method can thus be applied advantageously to the manufacture of electronic elements having a metal film thereon and high density printed circuits, and thus is also useful in the field of electronic industry.
Method of treating sandy soils to reduce water repellency therein
申请人:——
公开号:US20030106261A1
公开(公告)日:2003-06-12
Certain novel formulations of turf additives that act in such a manner as to permit proper amounts of moisture to contact root systems in order to reduce dry spots within highly managed turf areas and/or lawns. It is theorized that the accumulation of humic acid (and other natural byproduct deleterious compounds) at the topsoil surface in most cultivated grassy areas including sandy soils (such as, in particular, golf greens), results in the production of an effective organic waxy coating on the soil components. Such a coating is hydrophobic in nature and thus dries out the soil itself. The inventive formulation thus permits removal of such accumulated humic acid (and other compounds) from the topsoil to the level necessary to provide effective moisture penetration for sustained grass growth therein (hereinafter referred to as “redistributes”). Methods of providing such beneficial removal of humic substances from target sandy soils are also contemplated within this invention, as well as specific test hydrophobic sand formulations.
A conductive high molecular composition which comprises a non-conductive polymer component incorporated with a metal salt, characterized in that the melt salt is a salt of a metal with an acid substance selected from an organic carboxylic acid, rosin and a rosin derivative. This composition has an insulating property in the normal state but functions as an electroconductive material only in the event it is interposed between slightly spaced metals and heated. Thus, the composition can be used not only as an insulating binder but also for imparting conductivity only in the desired spots of electronic parts, keeping the other areas of the parts electrically insulated. The composition thus possessing a specific dual function is particularly useful in the electronic industry field.
Resin comprising a polyphenylene sulfide/polyphenylene sulfone block copolymer, process for preparing the copolymer and molded article
申请人:DAINIPPON INK AND CHEMICALS, INC.
公开号:EP0268765A2
公开(公告)日:1988-06-01
A resin composition comprising a block copolymer composed of polyphenylene sulfide segments and polyphenylene sulfide sulfone segments and at least one polymer selected from polyphenylene sulfides, polyphenylene sulfide sulfones, polysulfones, polyphenylene oxides, polyarylates, polycarbonates and polyetherimides, and optionally a filler.