2,2'-(((Oxybis(propane-2,1-diyl))bis(oxy))bis(methylene))bis(oxirane) | 52722-60-8

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 环氧化物
• 英文名称: 2,2'-(((Oxybis(propane-2,1-diyl))bis(oxy))bis(methylene))bis(oxirane)
• 英文别名: 2-[2-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propoxymethyl]oxirane
• CAS: 52722-60-8
• 化学式: C₁₂H₂₂O₅
• 分子量: 246.3
• InChiKey: HRYJRCRQCUEFLB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  0
• 重原子数：
  17
• 可旋转键数：
  10
• 环数：
  2.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  52.8
• 氢给体数：
  0
• 氢受体数：
  5

文献信息

• PHOTOCURABLE COMPOSITION, CURED PRODUCT AND OPTICAL COMPONENT USING SAME
  申请人：DAICEL CORPORATION

  公开号：US20180134838A1

  公开（公告）日：2018-05-17

  Provided is a photocurable composition which less causes resin-induced swelling of molds, allows the molds to endure more satisfactorily, and has excellent economic efficiency. This photocurable composition includes components (A), (B), (C), and (D). The component (A) is present in a content of 10 to 50 weight percent of the totality of photocurable compounds contained in the photocurable composition. The component (A) is a cycloaliphatic epoxy compound represented by Formula (a). The component (B) is an oxetane compound having a solubility parameter of 9.5 (cal/cm 3 ) 1/2 or more as determined by the Fedors' method. The component (C) is a glycidyl ether epoxy compound having a molecular weight of 250 or more. The component (D) is a photoinitiator: wherein R 1 to R 18 are each, identically or differently, selected from hydrogen, halogen, a hydrocarbon group optionally containing oxygen or halogen, and optionally substituted alkoxy; and X is selected from a single bond and a linkage group.

  提供的是一种光固化组合物，其引起模具树脂引起的膨胀较少，使模具更能承受，并具有优秀的经济效益。该光固化组合物包括组分（A），（B），（C）和（D）。组分（A）在光固化组合物中所含光固化化合物的总量的10至50重量％。组分（A）是由式（a）表示的环状脂肪族环氧化合物。组分（B）是具有由Fedors方法确定的溶解度参数为9.5（cal/cm3）1/2或更高的氧杂环丙烷化合物。组分（C）是具有分子量为250或更高的缩水甘油醚环氧化合物。组分（D）是光引发剂：其中R1到R18分别相同或不同地选择自氢，卤素，含氧或卤素的碳氢基团和可选择的取代烷氧基; X选择自单键和连接基团。
• Actinic radiation-curable stereolithographic resin composition having improved stability
  申请人：Ito Takashi

  公开号：US20070060682A1

  公开（公告）日：2007-03-15

  It is intended to provide the following resin composition for stereolithography which is superior in storage stability and aging stability during operation, shows no increase in viscosity upon prolonged storage, has a high light-curing sensitivity and, therefore, makes it possible to produce, upon photo irradiation, an object by stereolithography, which is superior in dimensional accuracy, fabricating accuracy, water resistance, moisture resistance and mechanical properties at a high fabricating speed and a high productivity. A resin composition for stereolithography which is an actinic radiation-curable resin composition containing a cationic-polymerizable organic compound, a radical-polymerizable organic compound, a photo cationic polymerization inhibitor and a photo radical polymerization inhibitor, in which the photo cationic polymerization inhibitor contains a compound represented by the following formula (I) and having a purity of 80% or higher: wherein M represents an antimony atom or a phosphorus atom; and the broken line between S + and MF 6 − represents an ionic bond.
• Composite resin molded article, laminate, multi-layer circuit board, and electronic device
  申请人：Fujimura Makoto

  公开号：US20090151984A1

  公开（公告）日：2009-06-18

  A composite resin molded article produced by impregnating cloth made from long fibers of a liquid crystal polymer with a curable resin composition which comprises a polymer (A) and a curing agent (B), the polymer (A) having a weight average molecular weight of 10,000 to 250,000 and containing 5 to 60 mol % of a carboxyl group or a carboxylic anhydride group; a method for manufacturing the composite resin molded article; a cured product produced by curing the composite resin molded article; a laminate made by laminating a substrate having a conductive layer (I) on the surface and an electrical insulating layer made of the cured product; a method for manufacturing the laminate; a multilayer circuit board comprising the laminate and a conductive layer (II) formed on an electrical insulating layer of the laminate; a method for manufacturing the circuit board; and an electronic device having the multilayer circuit board are provided. The composite resin molded article and the cured product thereof have excellent flame retardancy, electric insulation properties, and crack resistance, and generates only a very small amount of toxic substances during incineration. The laminate and multilayer circuit board have a low thermal expansion and a high modulus of elasticity. The conductive layer (II) exhibits high adhesion to a smooth electrical insulating layer, even if conductive layer (II) is formed on the electrical insulating layer by a deposition method and thus possesses high reliability. The multilayer circuit board has excellent electrical properties, and therefore can be used suitably as a substrate for a semiconductor device such as a CPU and memory, as well as other surface-mounted components in electronic devices.
• Curable Resin Composition and Use Thereof
  申请人：Tsukamoto Atsushi

  公开号：US20090283308A1

  公开（公告）日：2009-11-19

  A curable resin composition comprising an insulating polymer such as an alicyclic olefin polymer, a curing agent, and an inorganic filler, wherein the inorganic filler is silica particles whose surface is bound with 0.1 to 30% by weight, based on the weight of the silica particles, of an alkoxy group-containing silane-modified resin (I) whose weight average molecular weight is 2,000 or more; a shaped material formed by shaping the curable resin composition; and a multilayer printed circuit board obtained by thermally compressing and curing the shaped material on a substrate having a conductor layer on its surface to form an electrically insulating layer.
• CURABLE RESIN COMPOSITION, COMPOSITE BODY, MOLDED BODY, LAMINATED BODY AND MULTILAYERED CIRCUIT BOARD
  申请人：Furushita Tomoya

  公开号：US20100108367A1

  公开（公告）日：2010-05-06

  A curable resin composition comprising: 100 parts by weight of an alicyclic olefin polymer (A); from 1 to 100 parts by weight of a curing agent (B); from 10 to 50 parts by weight of a salt (C) of a basic nitrogen-containing compound with a phosphoric acid; and from 0.1 to 40 parts by weight of a condensed phosphate ester (D); of which phosphorus element content is not less than 1.5% by weight. The composition can provide a molded body or composite body which excels in a moisture resistance, a flame retardancy, a smoothness of the surface, and an electric insulation property and a cracking resistance, and hardly generates a harmful substance in burning. A multilayered circuit board is obtained by molding the composition into a sheet; laminating the sheet on an inner layer board; curing the laminated sheet to form an electric insulating layer; and forming an electric conducting layer on the electric insulating layer.