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Methyl 3-imidazol-1-yl-3-phenylpropanoate | 1344736-13-5

中文名称
——
中文别名
——
英文名称
Methyl 3-imidazol-1-yl-3-phenylpropanoate
英文别名
——
Methyl 3-imidazol-1-yl-3-phenylpropanoate化学式
CAS
1344736-13-5
化学式
C13H14N2O2
mdl
——
分子量
230.266
InChiKey
UTHNHENOEVZGDT-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    1.5
  • 重原子数:
    17
  • 可旋转键数:
    5
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.23
  • 拓扑面积:
    44.1
  • 氢给体数:
    0
  • 氢受体数:
    3

反应信息

  • 作为产物:
    描述:
    咪唑肉桂酸甲酯乙腈 为溶剂, 反应 24.0h, 以7%的产率得到Methyl 3-imidazol-1-yl-3-phenylpropanoate
    参考文献:
    名称:
    On the reactivity of imidazole carbamates and ureas and their use as esterification and amidation reagents
    摘要:
    The optimization, substrate scope, and mechanism of esterification and amidation of carboxylic acids mediated by imidazole-based reagents are discussed. The innate reactivity of carbonylimidazole reagents with a range of nucleophiles is also explored. New reagents developed for the synthesis of alpha,beta-unsaturated esters are described, as are reagents for the preparation of tertiary amides directly from carboxylic acids. (C) 2011 Elsevier Ltd. All rights reserved.
    DOI:
    10.1016/j.tet.2011.09.057
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文献信息

  • IMIDAZOLE COMPOUND, METAL SURFACE TREATMENT LIQUID, METAL SURFACE TREATMENT METHOD, AND LAMINATE PRODUCTION METHOD
    申请人:TOKYO OHKA KOGYO CO., LTD.
    公开号:US20170247334A1
    公开(公告)日:2017-08-31
    A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.
    一种新型咪唑化合物,可产生一种表面处理液,该液非常有效地抑制导线表面的迁移和氧化;一种含有咪唑化合物的属表面处理液;一种使用属表面处理液的属表面处理方法;以及一种使用表面处理液的层压板生产方法。使用包含饱和脂肪酸或饱和脂肪酸酯的表面处理液对属进行表面处理,其中,预定位置被预定结构的芳基取代,并且可能带有取代基的咪唑基。
  • Imidazole compound, metal surface treatment liquid, metal surface treatment method, and laminate production method
    申请人:TOKYO OHKA KOGYO CO., LTD.
    公开号:US10336708B2
    公开(公告)日:2019-07-02
    A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.
    一种新型咪唑化合物,它能产生一种非常有效地抑制线路表面迁移和氧化的表面处理液;一种含有该咪唑化合物的属表面处理液;一种使用该属表面处理液的属表面处理方法;以及一种使用该表面处理液的层压板生产方法。使用表面处理液对属进行表面处理,该表面处理液包括特定结构的饱和脂肪酸或饱和脂肪酸酯,其中规定的位置被规定结构的芳香基团和可能具有取代基团的咪唑基团取代。
  • Composition containing microparticles
    申请人:TOKYO OHKA KOGYO CO., LTD.
    公开号:US10570269B2
    公开(公告)日:2020-02-25
    A composition which contains microparticles and does not undergo the long-term process of aggregation of the microparticles during storage of the composition. An imidazole compound having a specific structure is added to a composition containing microparticles having a volume average particle diameter of 3000 nm or less. The composition may contain a base material component. The base material component may be a heat-curable or photocurable base material component. The microparticles may be inorganic particles and/or organic particles.
    一种含有微颗粒的组合物,在组合物储存期间不会经历微颗粒长期聚集的过程。将具有特定结构的咪唑化合物添加到含有体积平均粒径为 3000 nm 或更小的微颗粒的组合物中。该组合物可包含一种基础材料成分。基料成分可以是热固化或光固化基料成分。微颗粒可以是无机颗粒和/或有机颗粒。
  • Energy-sensitive resin composition
    申请人:TOKYO OHKA KOGYO CO., LTD.
    公开号:US10696845B2
    公开(公告)日:2020-06-30
    An energy-sensitive resin composition with which it is possible, even if the precursor polymer is heat-treated at low temperatures, to produce a film or molded article comprising an imide ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance with a low dielectric constant, or a film or molded article comprising an oxazole ring-containing polymer having excellent heat resistance, tensile elongation and chemical resistance. A method of manufacturing the film or molded article; a method of forming a pattern using the energy-sensitive resin composition; and a permanent film having excellent heat resistance, tensile elongation and chemical resistance. The energy-sensitive resin composition includes an imidazole compound, a resin precursor component, and a solvent, the resin precursor component being at least one of a monomer component including a diamine compound, a dicarbonyl compound and/or a tetracarboxylic acid dianhydride; and a precursor polymer having a repeating unit.
    一种能量敏感树脂组合物,使用该组合物,即使在低温下对前体聚合物进行热处理,也能生产出一种薄膜或模塑制品,该薄膜或模塑制品由具有优异耐热性、拉伸伸长率和耐化学性且介电常数较低的含亚胺环聚合物组成,或由具有优异耐热性、拉伸伸长率和耐化学性的含噁唑环聚合物组成。制造薄膜或模塑制品的方法;使用能量敏感树脂组合物形成图案的方法;以及具有优异耐热性、拉伸伸长率和耐化学性的永久性薄膜。能敏树脂组合物包括咪唑化合物、树脂前体组分和溶剂,树脂前体组分是单体组分中的至少一种,包括二胺化合物、二羰基化合物和/或四羧酸二酐;以及具有重复单元的前体聚合物。
  • COMPOSITION CONTAINING MICROPARTICLES
    申请人:TOKYO OHKA KOGYO CO., LTD.
    公开号:US20180194930A1
    公开(公告)日:2018-07-12
    A composition which contains microparticles and does not undergo the long-term process of aggregation of the microparticles during storage of the composition. An imidazole compound having a specific structure is added to a composition containing microparticles having a volume average particle diameter of 3000 nm or less. The composition may contain a base material component. The base material component may be a heat-curable or photocurable base material component. The microparticles may be inorganic particles and/or organic particles.
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