申请人:Osaku Yumi
公开号:US20140087136A1
公开(公告)日:2014-03-27
A resin composition which contains a binder resin (A), radiation-sensitive compound (B), silane-modified resin (C), and antioxidant (D), wherein a content of the silane-modified resin (C) is 0.1 to 150 parts by weight with respect to 100 parts by weight of the binder resin (A), a content of the antioxidant (D) is 0.1 to 10 parts by weight with respect to 100 parts by weight of the binder resin (A), and an amount of warping is 14 μm or less when using the resin composition to form a thickness 2 to 3 μm resin film and baking the formed resin film at 230° C. is provided.
一种树脂组合物,包含粘合剂树脂(A),辐射敏感化合物(B),硅改性树脂(C)和抗氧化剂(D),其中硅改性树脂(C)的含量相对于100份粘合剂树脂(A)为0.1至150份重量,抗氧化剂(D)的含量相对于100份粘合剂树脂(A)为0.1至10份重量,并且使用该树脂组合物形成2至3μm厚度的树脂膜并在230°C下烘烤形成的树脂膜翘曲量为14μm或以下。