2-{[(2-Ethyl-2-{[(oxiran-2-yl)methoxy]methyl}hexyl)oxy]methyl}oxirane | 94401-70-4

• 分子结构分类: 有机化合物 - 有机杂环化合物 - 环氧化物
• 英文名称: 2-{[(2-Ethyl-2-{[(oxiran-2-yl)methoxy]methyl}hexyl)oxy]methyl}oxirane
• 英文别名: 2-[[2-ethyl-2-(oxiran-2-ylmethoxymethyl)hexoxy]methyl]oxirane
• CAS: 94401-70-4
• 化学式: C₁₅H₂₈O₄
• 分子量: 272.38
• InChiKey: XKLGZQIUTOYSBB-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  2.3
• 重原子数：
  19
• 可旋转键数：
  12
• 环数：
  2.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  43.5
• 氢给体数：
  0
• 氢受体数：
  4

文献信息

• DIGLYCIDYL ETHERS
  申请人：Kyowa Yuka Co., Ltd.

  公开号：EP0911326A1

  公开（公告）日：1999-04-28

  The present invention relates to a diglycidyl ether represented by the following general formula (I): (wherein, R1 and R2 are the same or different, and represent lower alkyl having 1∼6 carbon atoms), a composition including the glycidyl ether and epoxy resin, and epoxy resin cured product obtained by the composition. The glycidyl ether can be used as a reactive diluent for epoxy resins.

  本发明涉及由以下通式（I）代表的二缩水甘油醚（其中，R1 和 R2 相同或不同，代表具有 1 ∼ 6 个碳原子的低级烷基）、包括该缩水甘油醚和环氧树脂的组合物，以及由该组合物获得的环氧树脂固化产品。 缩水甘油醚可用作环氧树脂的活性稀释剂。
• LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT DEVICE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3636688A1

  公开（公告）日：2020-04-15

  A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).

  一种用于压缩成型的液体树脂组合物含有脂肪族环氧化合物（A）、分子中含有芳香环的环氧化合物（B）、含氮杂环化合物（C）和无机填料（D）。
• EP3620481A1
  申请人：——

  公开号：EP3620481A1

  公开（公告）日：2020-03-11
• LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS
  申请人：Hitachi Chemical Company, Ltd.

  公开号：US20200194325A1

  公开（公告）日：2020-06-18

  A liquid resin composition for sealing contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D), wherein a percentage content of the inorganic filler (D) is 77% by mass or more with respect to a total mass of the composition.
• LIQUID RESIN COMPOSITION FOR COMPRESSION MOLDING AND ELECTRONIC COMPONENT APPARATUS
  申请人：Hitachi Chemical Company, Ltd.

  公开号：US20200181392A1

  公开（公告）日：2020-06-11

  A liquid resin composition for compression molding contains an aliphatic epoxy compound (A), an epoxy compound (B) having an aromatic ring in a molecule, a nitrogen-containing heterocyclic compound (C), and an inorganic filler (D).