This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.
Here described an efficient and regioselective hydroboration of epoxides to secondary alcohols, the reaction is catalyzed by a combined NaOH/BEt3 catalyst. Such a transition-metal-free catalytic system is suitable for many halogenated compounds and well-tolerated to olefin group under mild conditions.