The CuI-catalyzed carboxylation of terminal alkynes with CO2 and alkyl halides using ethylene carbonate as the solvent under mild conditions was studied. DFT calculations reveal that the energy barrier for CO2 insertion into the sp-hybridized Cu–C bond could be reduced by employing ethylene carbonate as the solvent. Notably, the procedure was conducted under ambient CO2 pressure without any external ligands. A broad range of substrates with electron-withdrawing groups or electron-donating groups gave the corresponding products in reasonable yields.
研究了在温和条件下,使用
乙烯碳酸酯作为溶剂,通过
CO2和烷基卤化物对末端
炔烃进行CuI催化的羧化反应。DFT计算表明,使用
乙烯碳酸酯作为溶剂能够降低 插入sp杂化Cu–C键的能量障碍。值得注意的是,整个过程是在常温常压的 条件下进行的,且没有使用任何外部
配体。多种具有电子吸引基团或电子捐赠基团的底物都能以合理的产率得到相应的产物。