The present invention relates to new types of metal complexes. Such compounds can be used as active components (=functional materials) in a series of different types of applications which can be classed within the electronics industry in the widest sense. The inventive compounds are described by the structure 1 and the formulae (1) to (60).
本发明涉及新型
金属配合物。这些化合物可以作为活性成分(=功能材料)用于广义上的电子工业中的各种不同类型的应用。这些创新的化合物由结构1和公式(1)至(60)描述。