Provided is an electrically conductive adhesive composition including: electrically conductive particles (A) containing metal having a melting point of equal to or lower than 220°C; a thermosetting resin (B); a flux activator (C); and a curing catalyst (D), in which a reaction start temperature of the thermosetting resin (B) and the curing catalyst (D) is 130 to 200°C.
所提供的导电粘合剂组合物包括:含有熔点等于或低于 220°C 的
金属的导电颗粒(A);热固性
树脂(B);助熔剂活化剂(C);以及固化催化剂(D),其中热固性
树脂(B)和固化催化剂(D)的反应起始温度为 130 至 200°C。