1,3,5-tris((4-hydroxyphenyl)ethynyl)benzene | 1019209-35-8

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 二芳基庚烷
• 英文名称: 1,3,5-tris((4-hydroxyphenyl)ethynyl)benzene
• 英文别名: 4-[2-[3,5-Bis[2-(4-hydroxyphenyl)ethynyl]phenyl]ethynyl]phenol；4-[2-[3,5-bis[2-(4-hydroxyphenyl)ethynyl]phenyl]ethynyl]phenol
• CAS: 1019209-35-8
• 化学式: C₃₀H₁₈O₃
• 分子量: 426.471
• InChiKey: MZKZVUSYFPNLRK-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  6.9
• 重原子数：
  33
• 可旋转键数：
  6
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.0
• 拓扑面积：
  60.7
• 氢给体数：
  3
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  1,3,5-tris((4-hydroxyphenyl)ethynyl)benzene 在 potassium methanolate 作用下， 以 甲醇 为溶剂， 以98.1%的产率得到1,3,5-tris(4-hydroxyphenylethynyl)benzene tripotassium salt
  参考文献：
  名称：

  1,3,5-Tris(functionalised-phenylethynyl)benzene–metal complexes: synthetic survey of mesoporous coordination polymers and investigation of their carbonisation

  摘要：

  合成了一系列多坐标的1,3,5-三（功能化苯乙炔基）苯（1–9），并从这些有机连接体和铜离子构建了高产率的配位聚合物。连接体1–9的炭化产出了表面展现出I型吸附-解吸等温线的微孔碳。尽管本研究中制备的大多数配位聚合物最终成为低孔材料，但通过1,3,5-三（4-羧基苯乙炔基）苯三钾盐（K37）与硝酸铜（II）反应生成的配位聚合物7e除了还得到了与K37分别与醋酸铜（II）和氯化铜（II）反应而制得的中孔材料（7c和7d）。配位聚合物的炭化无例外地导致微孔体积的增加。对在350、600和900 ℃下热解的7c进行的逐步分析揭示，热处理后中孔率几乎没有改变，换句话说，这表明微孔率可以通过炭化过程成功地添加到中孔配位聚合物中。

  DOI：

  10.1039/b715550f
• 作为产物：
  描述：

  1,3,5-tris[4-(tert-butyldimethylsilyloxy)phenylethynyl]benzene 在 氢氧化钾 、 水 作用下， 以 四氢呋喃 、 甲醇 为溶剂， 反应 12.0h， 以99.9%的产率得到1,3,5-tris((4-hydroxyphenyl)ethynyl)benzene
  参考文献：
  名称：

  1,3,5-Tris(functionalised-phenylethynyl)benzene–metal complexes: synthetic survey of mesoporous coordination polymers and investigation of their carbonisation

  摘要：

  合成了一系列多坐标的1,3,5-三（功能化苯乙炔基）苯（1–9），并从这些有机连接体和铜离子构建了高产率的配位聚合物。连接体1–9的炭化产出了表面展现出I型吸附-解吸等温线的微孔碳。尽管本研究中制备的大多数配位聚合物最终成为低孔材料，但通过1,3,5-三（4-羧基苯乙炔基）苯三钾盐（K37）与硝酸铜（II）反应生成的配位聚合物7e除了还得到了与K37分别与醋酸铜（II）和氯化铜（II）反应而制得的中孔材料（7c和7d）。配位聚合物的炭化无例外地导致微孔体积的增加。对在350、600和900 ℃下热解的7c进行的逐步分析揭示，热处理后中孔率几乎没有改变，换句话说，这表明微孔率可以通过炭化过程成功地添加到中孔配位聚合物中。

  DOI：

  10.1039/b715550f

文献信息

• TW2022/4298
  申请人：——

  公开号：——

  公开（公告）日：——
• TW2021/42526
  申请人：——

  公开号：——

  公开（公告）日：——
• AROMATIC UNDERLAYER
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：US20200142309A1

  公开（公告）日：2020-05-07

  Compounds having three or more alkynyl moieties substituted with an aromatic moiety having one or more of certain substituents are useful in forming underlayers useful in semiconductor manufacturing processes.
• COATING COMPOSITIONS AND METHODS OF FORMING ELECTRONIC DEVICES
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：US20210341840A1

  公开（公告）日：2021-11-04

  Coating compositions comprise: a curable compound comprising: a core chosen from a C 6 carbocyclic aromatic ring, a C 2-5 heterocyclic aromatic ring, a C 9-30 fused carbocyclic aromatic ring system, a C 4-30 fused heterocyclic aromatic ring system, C 1-20 aliphatic, and C 3-20 cycloaliphatic, and three or more substituents of formula (1) wherein at least two substituents of formula (1) are attached to the aromatic core; and wherein: Ar 1 is chosen from a C 6 carbocyclic aromatic ring, a C 2-5 heterocyclic aromatic ring, a C 9-30 fused carbocyclic aromatic ring system, and a C 4-30 fused heteroocyclic aromatic ring system; Z is a substituent independently chosen from OR 1 , protected hydroxyl, carboxyl, protected carboxyl, SR 1 , protected thiol, —O—C(═O)—C 1-6 alkyl, halogen, and NHR 2 ; wherein each R 1 is independently chosen from H, C 1-10 alkyl, C 2-10 unsaturated hydrocarbyl, and C 5-30 aryl; each R 2 is independently chosen from H, C 1-10 alkyl, C 2-10 unsaturated hydrocarbyl, C 5-30 aryl, C(═O)—R 1 , and S(═O) 2 —R 1 ; x is an integer from 1 to the total number of available aromatic ring atoms in Ar 1 ; and * denotes the point of attachment to the core; provided that no substituents of formula (1) are in an ortho position to each other on the same aromatic ring of the core; a polymer; and one or more solvents, wherein the total solvent content is from 50 to 99 wt % based on the coating composition. Coated substrates formed with the coating compositions and methods of forming electronic devices using the compositions are also provided. The compositions, coated substrates and methods find particular applicability in the manufacture of semiconductor devices.
• ADHESION PROMOTING PHOTORESIST UNDERLAYER COMPOSITION
  申请人：ROHM AND HAAS ELECTRONIC MATERIALS LLC

  公开号：US20220197143A1

  公开（公告）日：2022-06-23

  A photoresist underlayer composition comprising a poly(arylene ether); an additive of formula (14): D-(L 1 -Ar—[X] n ) m (14); and a solvent, wherein, in formula (14), D is a substituted or unsubstituted C 1-60 organic group, optionally wherein D is an organic acid salt of the substituted or unsubstituted C 1-60 organic group; each L 1 is independently a single bond or a divalent linking group, when L 1 is a single bond, D may be a substituted or unsubstituted C 3-30 cycloalkyl or substituted or unsubstituted C 1-20 heterocycloalkyl that is optionally fused with Ar, each Ar is independently a monocyclic or polycyclic C 5-60 aromatic group, each X is independently —OR 30 , —SR 31 , or —NR 32 R 33 , m is an integer of 1 to 6, each n is independently an integer of 0 to 5, provided that a sum of all n is 2 or greater, and R 30 to R 33 are as provided herein.