LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMICONDUCTOR DEVICE HAVING CURED PRODUCT OF SAME
申请人:Shin-Etsu Chemical Co., Ltd.
公开号:US20170158926A1
公开(公告)日:2017-06-08
Provided is a liquid resin composition superior in flatness after screen printing, stability in B stage, adhesiveness to a dicing tape, dicing property and adhesion to a lead frame. The liquid resin composition comprises given amounts of
(A) an epoxy resin having not less than two epoxy groups in one molecule;
(B) a curing agent having not less than two groups in one molecule that are reactive with epoxy groups;
(C) an acrylic resin;
(D) a curing agent;
(E) an inorganic filler;
(F) a diluent; and
(G) a dimethyl silicone.